公开(公告)号：US20020160576A1

公开(公告)日：2002-10-31

申请号：US10177435

申请日：2002-06-21

Applicant: Memscap S.A.

Inventor： Laurent Basteres ,  Ahmed Mhani ,  Francois Valentin ,  Jean-Michel Karam

IPC: H01L021/20

CPC classification number: H01L28/10 ,  H01F17/0006 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising: a semiconductor substrate layer (2); a passivation layer (4) covering the substrate layer (2); metal contact pads (5) connected to the substrate (2) and passing through the passivation layer (4) in order to be flush with the upper face (6) of the passivation layer (4); which circuit also includes a spiral winding (20) which forms an inductor and lies in a plane parallel to the upper face (6) of the passivation layer (4), said winding (20) consisting of copper turns (21-23, 27, 28) having a thickness of greater than 10 microns, the winding ends forming extensions (12) which extend below the plane of the winding (20) and are connected to the contact pads (5).

Abstract translation: 一种结合电感元件（2）的单体集成电路（1），包括：半导体衬底层（2）; 覆盖衬底层（2）的钝化层（4）; 金属接触焊盘（5），其连接到衬底（2）并通过钝化层（4）以与钝化层（4）的上表面（6）齐平; 该电路还包括形成电感器并且位于平行于钝化层（4）的上表面（6）的平面中的螺旋绕组（20），所述绕组（20）由铜匝（21-23,27） ，28），所述绕组端形成在所述绕组（20）的平面下方延伸并延伸到所述接触焊盘（5）的延伸部（12）。