Methods for correcting substrate thickness variation for waveguide applications

    公开(公告)号:US12298551B1

    公开(公告)日:2025-05-13

    申请号:US17830276

    申请日:2022-06-01

    Abstract: Disclosed herein are techniques for waveguide displays. According to some embodiments, a method for fabricating a multi-layer optical device comprising includes measuring thickness variations within a target area of a first substrate for fabricating a first optical element of the multi-layer optical device and determining, based on the measuring, a thickness correction map indicating amounts of material to be removed in different regions of the target area to planarize the target area. The method also includes planarizing the target area of the first substrate based on the thickness correction map and bonding the first substrate to a second substrate that comprises a second optical element fabricated thereon to form a layer stack, wherein the target area of the first substrate aligns with and is bonded to the second optical element to form a multi-layer structure. The method further includes singulating the multi-layer structure from the layer stack.

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