公开(公告)号：US08895338B2

公开(公告)日：2014-11-25

申请号：US13074487

申请日：2011-03-29

Applicant: Michael A. Huff

Inventor： Michael A. Huff

IPC: H01L21/00 ,  B81C99/00

CPC classification number: B81C99/006

Abstract: An improved method for the fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Photonics, Nanotechnology, 3-Dimensional Integration, Micro- and Nano-Fabricated Devices and Systems for both rapid prototyping development and manufacturing is disclosed. The method includes providing a plurality of different standardized and repeatable process modules usable in fabricating the devices and systems, defining a process sequence for fabricating a predefined one of the devices or systems, and identifying a series of the process modules that are usable in performing the defined process sequence and thus in fabricating the predefined device or system.

Abstract translation: 用于快速成型开发的微机电系统（MEMS），纳米机电系统（NEMS），光子学，纳米技术，三维集成，微纳米制造设备和系统的改进方法 并且公开了制造。 该方法包括提供多个不同的标准化和可重复的过程模块，可用于制造设备和系统，定义用于制造设备或系统中的预定义的设备或系统的过程序列，以及识别可用于执行设备和系统的一系列过程模块 并且因此在制造预定义的装置或系统中。

公开(公告)号：US07024936B2

公开(公告)日：2006-04-11

申请号：US10462811

申请日：2003-06-17

Applicant: Michael Pedersen ,  Mehmet Ozgur ,  Michael A. Huff

Inventor： Michael Pedersen ,  Mehmet Ozgur ,  Michael A. Huff

IPC: G01L9/12

CPC classification number: G01L9/0073

Abstract: A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.

公开(公告)号：US20100326262A1

公开(公告)日：2010-12-30

申请号：US12267245

申请日：2008-11-07

Applicant: Benjamin J. Galanti ,  David J. Broadhead ,  Michael A. Huff

Inventor： Benjamin J. Galanti ,  David J. Broadhead ,  Michael A. Huff

IPC: B64D1/00

CPC classification number: F42B5/155 ,  B64D7/00 ,  F41H11/02 ,  F42B12/70

Abstract: According to one embodiment, a chaff pod includes at least two dispensers disposed within a chaff pod housing. Each of the dispensers has a surface defining an opening through which a number of countermeasures may be dispensed. The dispensers are configured to be coupled to the aircraft. The first dispenser directs countermeasures in a first direction, and the second dispenser directs countermeasures in a second direction. The difference between the first direction and the second direction form a relative angle.

Abstract translation: 根据一个实施例，谷壳荚包括设置在谷壳荚壳体内的至少两个分配器。 每个分配器具有限定开口的表面，通过该开口可以分配许多对策。 分配器被配置为联接到飞行器。 第一分配器在第一方向上引导对策，并且第二分配器在第二方向上引导对策。 第一方向和第二方向之间的差异形成相对角度。

公开(公告)号：US07679042B1

公开(公告)日：2010-03-16

申请号：US11753258

申请日：2007-05-24

Applicant: Allen M. Flusberg ,  Michael A. Huff

Inventor： Allen M. Flusberg ,  Michael A. Huff

IPC: H01L27/00

CPC classification number: H01L27/14683

Abstract: Methods for fabricating structures such as transducer pedestal structures and transducers fabricated by the methods.

Abstract translation: 用于制造诸如换能器基座结构和通过该方法制造的换能器的结构的方法。

公开(公告)号：US20090002914A1

公开(公告)日：2009-01-01

申请号：US12216006

申请日：2008-06-27

Applicant: Michael A. Huff ,  Mehmet Ozgur

Inventor： Michael A. Huff ,  Mehmet Ozgur

IPC: H01G7/00

CPC classification number: H01G5/145 ,  H01L28/60

Abstract: A variable capacitor device is disclosed in which the capacitive tuning ratio and quality factor are increased to very high levels, and in which the capacitance value of the device is tuned and held to a desired value with a high level of accuracy and precision using a laser micromachining tuning process on suitably designed and fabricated capacitor devices. The tuning of the variable capacitor devices can be performed open-loop or closed-loop, depending on the precision of the eventual capacitor value needed or desired. Furthermore, the tuning to a pre-determined value can be performed before the variable capacitor device is connected to a circuit, or alternatively, the tuning to a desired value can be performed after the variable capacitor device has been connected into a circuit.

Abstract translation: 公开了一种可变电容器件，其中电容调谐率和品质因数增加到非常高的水平，并且其中使用激光器将器件的电容值调整并保持在高精度和精度的期望值 在适当设计和制造的电容器装置上的微加工调谐过程。 可变电容器件的调谐可根据最终需要或期望的电容值的精度进行开环或闭环。 此外，可调谐到预定值之前可以在可变电容器件连接到电路之前执行，或者可以在可变电容器装置已经连接到电路中之后执行到期望值的调谐。

公开(公告)号：US07017419B2

公开(公告)日：2006-03-28

申请号：US10929446

申请日：2004-08-31

Applicant: Michael Pedersen ,  Mehmet Ozgur ,  Michael A. Huff

Inventor： Michael Pedersen ,  Mehmet Ozgur ,  Michael A. Huff

IPC: G01L9/12

CPC classification number: G01L9/0073

Abstract: A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.

Abstract translation: 公开了一种微机械压力传感器，其中电容式换能器结构与电感线圈集成以形成LC谐振电路，其谐振频率可以通过在换能器上施加电磁场而远程检测。 电容式换能器结构包括导电可移动隔膜，固定相对电极和所述隔膜与电极之间的预定气隙。 隔膜响应于施加的压力差而偏转，导致结构中的电容变化，并因此导致LC谐振电路的谐振频率偏移。 可以通过测量和确定换能器的电磁阻抗中相应的峰值来远程检测LC电路的谐振频率。

公开(公告)号：US07012327B2

公开(公告)日：2006-03-14

申请号：US10835590

申请日：2004-04-30

Applicant: Michael A. Huff ,  Mehmet Ozgur

Inventor： Michael A. Huff ,  Mehmet Ozgur

IPC: H01L29/80

CPC classification number: B82Y30/00 ,  B81B7/0064 ,  B81B2201/016 ,  B81B2207/015 ,  B81B2207/092 ,  B81B2207/095 ,  B81B2207/096 ,  B81C2203/0118 ,  B81C2203/035 ,  H01G5/16 ,  H01G5/18 ,  H01G5/40 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2059/0072 ,  H01L2224/16225 ,  H01L2924/15153 ,  H01P1/127 ,  H01P1/184 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q15/0013 ,  H01Q15/004 ,  H01Q21/0087 ,  H05K1/0306 ,  H05K1/16

Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.

Abstract translation: 使用微机电开关（“MEMS”）和低温共烧陶瓷（“LTCC”）技术的相控阵天线系统和其它类型的射频（RF）装置和系统以及制造这种相控阵天线的方法 系统和其他类型的射频（RF）设备。 每个天线或其他类型的装置包括至少两个多层陶瓷模块和在其中一个模块上制造的MEMS装置。 一旦完成了MEMS器件的制造，就将两个陶瓷模块结合在一起，密封MEMS器件，并允许所有器件层之间的电连接。 底部陶瓷模块在背面还具有用于安装集成电路的空腔。 内部层使用标准LTCC制造和低损耗介电LTCC带材料中可用的导电，电阻和高k电介质浆料形成。

公开(公告)号：US09099248B2

公开(公告)日：2015-08-04

申请号：US12216006

申请日：2008-06-27

Applicant: Michael A. Huff ,  Mehmet Ozgur

Inventor： Michael A. Huff ,  Mehmet Ozgur

IPC: H01G7/00 ,  H01G5/14 ,  H01L49/02

CPC classification number: H01G5/145 ,  H01L28/60

Abstract: A variable capacitor device is disclosed in which the capacitive tuning ratio and quality factor are increased to very high levels, and in which the capacitance value of the device is tuned and held to a desired value with a high level of accuracy and precision using a laser micromachining tuning process on suitably designed and fabricated capacitor devices. The tuning of the variable capacitor devices can be performed open-loop or closed-loop, depending on the precision of the eventual capacitor value needed or desired. Furthermore, the tuning to a pre-determined value can be performed before the variable capacitor device is connected to a circuit, or alternatively, the tuning to a desired value can be performed after the variable capacitor device has been connected into a circuit.

公开(公告)号：US08852378B2

公开(公告)日：2014-10-07

申请号：US12458073

申请日：2009-06-30

Applicant: Michael A. Huff ,  Paul Sunal

Inventor： Michael A. Huff ,  Paul Sunal

IPC: C22C1/00 ,  H01L23/373 ,  C22C1/04 ,  H01L23/473 ,  H01S5/024 ,  H01S5/40

CPC classification number: C22C1/00 ,  C22C1/045 ,  H01L23/3736 ,  H01L23/473 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01S5/02423 ,  H01S5/02476 ,  H01S5/4025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates generally to a metallic alloy composed of Titanium and Tungsten that together form an alloy having a Coefficient of Thermal Expansion (CTE), wherein the content of the respective constituents can be adjusted so that the alloy material can be nearly perfectly matched to that of a commonly used semiconductor and ceramic materials. Moreover, alloys of Titanium-Tungsten have excellent electrical and thermal conductivities making them ideal material choices for many electrical, photonic, thermoelectric, MMIC, NEMS, nanotechnology, power electronics, MEMS, and packaging applications. The present invention describes a method for designing the TiW alloy so as to nearly perfectly match the coefficient of thermal expansion of a large number of different types of commonly used semiconductor and ceramic materials. The present invention also describes a number of useful configurations wherein the TiW material is made as well as how it can be shaped, formed and polished into heat sink, heat spreaders, and electrodes for many applications. The present invention also discloses the direct bonding of a TiW substrate to a semiconductor substrate.

Abstract translation: 本发明一般涉及由钛和钨组成的金属合金，其一起形成具有热膨胀系数（CTE）的合金，其中可以调节各组分的含量，使得合金材料可以几乎完全匹配 一种常用的半导体和陶瓷材料。 此外，钛钨合金具有优异的导电性和导热性，使其成为许多电子，光子，热电，MMIC，NEMS，纳米技术，电力电子，MEMS和封装应用的理想材料选择。 本发明描述了一种用于设计TiW合金的方法，几乎​​完全匹配大量不同类型的常用半导体和陶瓷材料的热膨胀系数。 本发明还描述了许多有用的构造，其中制造TiW材料以及如何将其形成，形成和抛光成散热器，散热器和用于许多应用的电极。 本发明还公开了将TiW衬底直接接合到半导体衬底上。

公开(公告)号：US08660157B2

公开(公告)日：2014-02-25

申请号：US13549705

申请日：2012-07-16

Applicant: Michael A. Huff ,  Jonah Jacob

Inventor： Michael A. Huff ,  Jonah Jacob

IPC: H01S3/04

CPC classification number: H01S5/4025 ,  H01L2224/83192 ,  H01L2924/1461 ,  H01S5/02256 ,  H01S5/02264 ,  H01S5/024 ,  H01S5/02423 ,  H01S5/02484 ,  H01S5/0425 ,  H01L2924/00

Abstract: A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates.

Abstract translation: 公开了一种激光二极管系统，其中由含有激光二极管的半导体材料制成的衬底被结合到由金属材料制成的衬底上，而不使用两个衬底之间的任何中间接合或焊接层。 金属衬底用作激光二极管半导体衬底的电极和/或散热器。 微通道可以包括在金属基板中以允许冷却剂流体通过，从而有助于从激光二极管基板去除热量。 包括冷却流体微通道的第二金属衬底也可以结合到激光二极管衬底以提供来自激光二极管衬底的更大的热传递。 低温下的基板的结合以及对基板表面的修改结合使得能够实现接合的基板之间的低电阻界面和低热阻界面。