公开(公告)号：US20240172355A1

公开(公告)日：2024-05-23

申请号：US18387195

申请日：2023-11-06

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Deepu Narasiah Subhash

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0206 ,  H05K3/30 ,  G06F1/206

Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a fin stack to improve heat dissipation to improve a data transfer rate. The processor measures temperature of at least one of the processing device or the set of memory components. The processor accesses a reference temperature for controlling data transfer rate between a host and the set of memory components. The processor compares the measured temperature with the reference temperature and, based on the comparison, adjusts the data transfer rate based on comparing the measured temperature with the reference temperature.