公开(公告)号：US08882310B2

公开(公告)日：2014-11-11

申请号：US13709121

申请日：2012-12-10

Applicant: Microsoft Corporation

Inventor： David Mandelboum ,  Giora Yahav ,  Asaf Pellman ,  Shlomo Felzenshtein

IPC: F21V29/00 ,  G01S17/89 ,  F21V13/02 ,  H05K1/02 ,  G02B27/20 ,  F21V21/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40

CPC classification number: F21V21/00 ,  F21V13/02 ,  G01S17/89 ,  G02B27/0938 ,  G02B27/0944 ,  G02B27/20 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02212 ,  H01S5/02236 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/06209 ,  H01S5/06216 ,  H01S5/4031 ,  H05K1/0243 ,  H05K1/0296 ,  H05K3/0052 ,  H05K2201/09145 ,  H05K2201/10106

Abstract: An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.

Abstract translation: 本发明的一个实施例提供了一种低电感光源模块，其可以具有小的占地面积，并且包括印刷电路板（PCB）安装座，其具有形成在PCB安装座侧面上的第一和第二导电迹线，以及半导体光源，其具有 用于用导电接合材料接合与第一导电迹线接合电力的第一电触点，以及用于接收通过至少一个键合线连接到第二导电迹线的功率的第二电接触。

公开(公告)号：US20140160745A1

公开(公告)日：2014-06-12

申请号：US13709121

申请日：2012-12-10

Applicant: MICROSOFT CORPORATION

Inventor： David Mandelboum ,  Giora Yahav ,  Asaf Pellman ,  Shlomo Felzenshtein

IPC: F21V21/00 ,  F21V13/02

CPC classification number: F21V21/00 ,  F21V13/02 ,  G01S17/89 ,  G02B27/0938 ,  G02B27/0944 ,  G02B27/20 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02212 ,  H01S5/02236 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/06209 ,  H01S5/06216 ,  H01S5/4031 ,  H05K1/0243 ,  H05K1/0296 ,  H05K3/0052 ,  H05K2201/09145 ,  H05K2201/10106

Abstract: An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.

Abstract translation: 本发明的一个实施例提供了一种低电感光源模块，其可以具有小的占地面积，并且包括印刷电路板（PCB）安装座，其具有形成在PCB安装座侧面上的第一和第二导电迹线，以及半导体光源，其具有 用于用导电接合材料接合与第一导电迹线接合电力的第一电触点，以及用于接收通过至少一个键合线连接到第二导电迹线的功率的第二电接触。