公开(公告)号：US20230199971A1

公开(公告)日：2023-06-22

申请号：US17645247

申请日：2021-12-20

Applicant: Microsoft Technology Licensing, LLC

Inventor： David Christopher PERNA ,  Elisa Naseem HAQQ ,  Daniel Tusteh CHIAN ,  Kevin The-Hung PHAM

IPC: H05K3/36 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K3/363 ,  H05K1/0277 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/09609 ,  H05K2203/043

Abstract: Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.