公开(公告)号：US20160216748A1

公开(公告)日：2016-07-28

申请号：US14603142

申请日：2015-01-22

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kurt A. JENKINS ,  Edward BURRESS ,  Jaya NARAIN ,  Robert J. BERGESON ,  Andrew W. HILL ,  Taylor STELLMAN

IPC: G06F1/20 ,  G06F3/041 ,  G06F3/045 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1626 ,  G06F1/1643 ,  G06F1/1658 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/045 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K7/2039 ,  H05K7/20436 ,  H01L2924/00

Abstract: The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.

Abstract translation: 该描述涉及诸如计算设备的设备。 一个例子可以包括三明治结构复合材料外壳。 该示例还可以包括位于夹层结构复合外壳上的一组电子部件。 该组电子部件可以具有抵抗夹层结构复合外壳的轮廓。 三明治结构复合外壳可以具有相应的负曲线。

公开(公告)号：US20170097665A1

公开(公告)日：2017-04-06

申请号：US15380274

申请日：2016-12-15

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kurt A. JENKINS ,  Edward BURRESS ,  Jaya NARAIN ,  Robert J. BERGESON ,  Andrew W. HILL ,  Taylor STELLMAN

IPC: G06F1/20 ,  H01L23/40 ,  H01L23/373 ,  H05K7/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1626 ,  G06F1/1643 ,  G06F1/1658 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/045 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K7/2039 ,  H05K7/20436 ,  H01L2924/00

Abstract: The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.

公开(公告)号：US20170052575A1

公开(公告)日：2017-02-23

申请号：US14828400

申请日：2015-08-17

Applicant: Microsoft Technology Licensing, LLC

Inventor： Taylor STELLMAN ,  Bert B. BUXTON ,  Nathan M. THOME

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1658 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/552 ,  H01L23/66 ,  H05K7/20409 ,  H05K7/20436 ,  H05K9/0035

Abstract: The description relates to devices, such as computing devices. One example can include a shielded and cooled circuit board assembly including a biasing sub-assembly that can bias a heat generating component and a thermal module together. The biasing sub-assembly can also define a portion of a Faraday cage around the heat generating component.

Abstract translation: 该描述涉及诸如计算设备的设备。 一个示例可以包括屏蔽和冷却的电路板组件，其包括可将发热部件和热模块偏置在一起的偏置子组件。 偏置子组件还可以围绕发热部件限定法拉第笼的一部分。