公开(公告)号：US09890276B2

公开(公告)日：2018-02-13

申请号：US13809893

申请日：2010-07-14

Applicant: Ming-She Su

Inventor： Ming-She Su

IPC: C08L47/00 ,  H05K3/02 ,  H05K1/03 ,  H05K3/44 ,  C08L71/12

CPC classification number: C08L47/00 ,  C08K3/016 ,  C08K3/36 ,  C08L9/00 ,  C08L71/126 ,  H05K1/0313 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/44 ,  H05K2201/012

Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making the circuit substrate of a high-frequency electronic equipment.

公开(公告)号：US20130180770A1

公开(公告)日：2013-07-18

申请号：US13809893

申请日：2010-07-14

Applicant: Ming-She Su

Inventor： Ming-She Su

IPC: C08L47/00 ,  H05K3/44 ,  H05K1/03

CPC classification number: C08L47/00 ,  C08K3/016 ,  C08K3/36 ,  C08L9/00 ,  C08L71/126 ,  H05K1/0313 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/44 ,  H05K2201/012

Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making the circuit substrate of a high-frequency electronic equipment.

Abstract translation: 复合材料及其制造方法技术领域本发明涉及复合材料，由其制成的高频电路基板及其制造方法。 该复合材料包括：包含多于一种分子量小于10000的含有极性官能团的液体乙烯基树脂的热固性混合物和分子末端具有不饱和双键的分子量小于5000的聚苯醚树脂; 玻璃纤维布; 粉末填料; 阻燃和固化引发剂。 由复合材料制成的高频电路基板包括相互重叠的多个预浸料，分别覆盖在重叠的预浸料的两侧的铜箔; 每个预浸料由复合材料制成。 防止发明的复合材料实现了预浸料的容易制造和对铜箔的高粘结力。 由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切，耐热性优异，方便操作。 因此，本发明的复合材料适用于制造高频电子设备的电路基板。