公开(公告)号：US20220295638A1

公开(公告)日：2022-09-15

申请号：US17588630

申请日：2022-01-31

Applicant: Monolithic Power Systems, Inc.

Inventor： Daocheng Huang ,  Zhao Yuan ,  Yishi Su ,  Wenyang Huang ,  Xintong Lyu

IPC: H05K1/18 ,  H01F27/24 ,  H01F27/28 ,  H05K1/14 ,  H05K1/11

Abstract: A sandwich structure power supply module, having: an inductor pack having a first inductor and a second inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and a first power device chip and a second power device chip on top of the top PCB, wherein the first power device chip has at least one pin electrically connected to the first inductor via the top PCB, and the second power device chip has at least one pin electrically connected to the second inductor via the top PCB; wherein each inductor comprises one winding having a first end and a second end, and wherein at least one of the first end and the second end of each winding is bent to and extended at a plane perpendicular to an axis along a length of the winding.

公开(公告)号：US20220295639A1

公开(公告)日：2022-09-15

申请号：US17589277

申请日：2022-01-31

Applicant: Monolithic Power Systems, Inc.

Inventor： Daocheng Huang ,  Zhao Yuan ,  Yishi Su ,  Wenyang Huang ,  Xintong Lyu

IPC: H05K1/18 ,  H01F27/24 ,  H01F27/28 ,  H05K1/14 ,  H05K1/11

Abstract: A sandwich structure power supply module, having: an inductor pack having at least one inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and at least one power device chip on top of the top PCB, wherein each one of the power device chips has at least one pin connected to an associated inductor via the top PCB; wherein the inductor pack is wrapped with metal layers, wherein each two metal layers are lied against to a same surface of the inductor pack, with an isolation layer in between, and wherein the two metal layers are connected to different potentials.