公开(公告)号：US20240331949A1

公开(公告)日：2024-10-03

申请号：US18733992

申请日：2024-06-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Haruki KOBAYASHI ,  Akio MASUNARI

IPC: H01G4/33 ,  H01G2/06 ,  H01G4/012 ,  H01G4/224

CPC classification number: H01G4/33 ,  H01G4/012 ,  H01G4/224 ,  H01G2/065

Abstract: A capacitor that includes: an insulating substrate having a first main surface and a second main surface; a capacitance forming part facing the first main surface, the capacitance forming part having a conductive metal porous body, a dielectric film covering a surface of the metal porous body, and a conductive film covering the dielectric film; a first external connection line that includes a first via conductor penetrating the insulating substrate and connected to the conductive metal porous body; and a second external connection line that includes a second via conductor penetrating the insulating substrate, and an internal conductor covering the conductive film so as to fill a space inside the capacitance forming part, and the conductive film and the second via conductor are connected with at least the internal conductor interposed therebetween.

公开(公告)号：US20200303124A1

公开(公告)日：2020-09-24

申请号：US16805889

申请日：2020-03-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akio MASUNARI ,  Yukie WATANABE

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12 ,  H01G4/224 ,  H01G4/33

Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes and including main surfaces facing each other in a stacking direction, lateral surfaces facing each other in a width direction, and end surfaces facing each other in a length direction, and an external electrode electrically connected with the internal electrodes on the end surfaces. The external electrode includes an end surface covering portion covering each of the end surfaces, and a main surface covering portion covering portions of the main surfaces. The end surface and main surface covering portions each include a base electrode layer covering the ceramic body, and a plating layer covering the base electrode layer. The end surface covering portion further includes, between the base electrode layer and the plating layer, a sintered metal layer including a component different from that of the base electrode layer.

公开(公告)号：US20230215644A1

公开(公告)日：2023-07-06

申请号：US18121040

申请日：2023-03-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinobu CHIKUMA ,  Nobuyuki KOIZUMI ,  Akio MASUNARI ,  Yukie WATANABE

IPC: H01G4/232 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/1209 ,  H01G4/248 ,  H01G4/30

Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.

公开(公告)号：US20210272756A1

公开(公告)日：2021-09-02

申请号：US17169707

申请日：2021-02-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinobu CHIKUMA ,  Nobuyuki KOIZUMI ,  Akio MASUNARI ,  Yukie WATANABE

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H01G4/12

Abstract: A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.

公开(公告)号：US20250069805A1

公开(公告)日：2025-02-27

申请号：US18942859

申请日：2024-11-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki IWAJI ,  Yuuto YAMAMOTO ,  Isao KIMURA ,  Akio MASUNARI

IPC: H01G2/14 ,  H01G4/002

Abstract: A capacitor that includes: a metal base material; a dielectric layer on the metal base material; a conductive layer on the dielectric layer; an oxide layer between the metal base material and the dielectric layer; and an oxygen barrier layer between the oxide layer and the dielectric layer, wherein the oxide layer includes: a first oxidized region containing a metal of the metal base material; and a second oxidized region containing an atom of the oxygen barrier layer and a metal of the metal base material, and a thickness of the first oxidized region is 3 nm or less and is 0% to 50% of a thickness of the second oxidized region.

公开(公告)号：US20190157007A1

公开(公告)日：2019-05-23

申请号：US16255903

申请日：2019-01-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akio MASUNARI

IPC: H01G4/30 ,  H01G4/232 ,  H05K1/11 ,  H01G4/005 ,  H05K3/34 ,  H01G4/12 ,  H05K1/18 ,  H01G4/248

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/11 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.

公开(公告)号：US20170208691A1

公开(公告)日：2017-07-20

申请号：US15389484

申请日：2016-12-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akio MASUNARI ,  Hirokazu TAKASHIMA ,  Tomoyuki NAKAMURA

IPC: H05K1/18 ,  H01G4/30 ,  H05K1/09 ,  H01G4/12 ,  H01G4/248 ,  H05K3/34 ,  H05K1/11 ,  H01G4/005

CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01G4/40 ,  H05K1/09 ,  H05K1/111 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic capacitor includes a ceramic element body including first and second external electrodes on first and second end surface sides of the ceramic element body, respectively. The first external electrode includes an Ni plating layer and an Sn plating layer defining a plating layer. The second external electrode includes an Au plating layer defining a plating layer.

公开(公告)号：US20180268999A1

公开(公告)日：2018-09-20

申请号：US15916386

申请日：2018-03-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kohei SHIMADA ,  Akio MASUNARI ,  Yuta SAITO ,  Shunsuke ABE ,  Tomoo YUGUCHI

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/232

Abstract: A multilayer ceramic capacitor includes a laminate with a rectangular or substantially rectangular parallelepiped shape and including dielectric layers, first internal electrode layers, and second internal electrode layers that are laminated; a first external electrode connected with the first internal electrode layers; and a second external electrode connected with the second internal electrode layers. Each of the first internal electrode layers or the second internal electrode layers has a coverage in a central portion in a W direction that is lower than a coverage within about 30.000 μm from an end portion in the W direction, and has a shifting amount in the W direction of about 0.000 μm or more and about 10.000 μm or less.

公开(公告)号：US20170256359A1

公开(公告)日：2017-09-07

申请号：US15447274

申请日：2017-03-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akio MASUNARI

IPC: H01G4/30 ,  H01G4/005 ,  H05K1/11 ,  H01G4/232 ,  H01G4/248 ,  H05K1/18 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/11 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.

公开(公告)号：US20170207029A1

公开(公告)日：2017-07-20

申请号：US15390786

申请日：2016-12-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koki SHIBUYA ,  Hirokazu TAKASHIMA ,  Akio MASUNARI ,  Tomoyuki NAKAMURA

IPC: H01G4/40 ,  H01G4/005 ,  H01G4/30 ,  H01F27/29 ,  H03H1/00 ,  H03H7/01 ,  H01F27/28 ,  H05K1/18 ,  H01G4/248

CPC classification number: H01G4/40 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0026 ,  H01F2027/2809 ,  H01G4/005 ,  H01G4/248 ,  H01G4/30 ,  H03H1/00 ,  H03H1/0007 ,  H03H7/0115 ,  H03H2001/0021 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003

Abstract: A composite electronic component includes a substrate with a first main surface and a side end surface, a first electronic component including external electrodes and mounted on the first main surface of the substrate, a second electronic component including external electrodes and being different in electrical function from the first electronic component mounted on the first main surface of the substrate, and a conductive pattern on the first main surface of the substrate, electrically connecting the first electronic component and the second electronic component to each other, and including one end reaching a side of one side end of the substrate, one external electrode of the first electronic component and one external electrode of the second electronic component being located on the side of the one side end of the substrate, another external electrode of the first electronic component and another external electrode of the second electronic component being connected to the conductive pattern, and the composite electronic component being mounted such that a surface of the substrate on the side of the one side end is opposed to a first main surface of a mount substrate.