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公开(公告)号：US20210242569A1
公开(公告)日：2021-08-05
申请号：US17237624
申请日：2021-04-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Norikazu FUJII , Michiharu YOKOYAMA
Abstract: A wiring substrate for supplying a radio frequency signal to an antenna module having a first antenna element and a second antenna element includes a dielectric substrate having a laminated structure, a first power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the first antenna element, a second power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the second antenna element, and a ground conductor that is formed in a layer different from any one of a layer in which the first power supply wiring is formed and a layer in which the second power supply wiring is formed, and in which a hole portion is formed in a portion between the first power supply wiring and the second power supply wiring of the dielectric substrate toward the ground conductor.
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公开(公告)号：US20240363546A1
公开(公告)日：2024-10-31
申请号：US18769482
申请日：2024-07-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Michiharu YOKOYAMA , Takaya NEMOTO , Hideki UEDA
IPC: H01L23/552 , H01L23/00 , H01L23/31 , H01L23/538 , H01L25/10 , H01Q1/22
CPC classification number: H01L23/552 , H01L23/3135 , H01L23/538 , H01L24/16 , H01L25/105 , H01Q1/2283 , H01L2224/16227
Abstract: Electronic components are included in each one of submodules. Each electronic component includes inner terminals. A first support member covers and supports, the electronic components so as to expose the inner terminals. A second support member supports the submodules. Each one of the submodules includes outer terminals, and the outer terminals are coupled to respective inner terminals and exposed from the second support member. At least one of the submodules has a first conductive film formed on at least part of the first support member.
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3.发明公开公开(公告)号：US20240120663A1
公开(公告)日：2024-04-11
申请号：US18480541
申请日：2023-10-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kouta KINUGAWA , Atsushi KASUYA , Michiharu YOKOYAMA , Kengo ONAKA
CPC classification number: H01Q21/065 , H01Q9/045
Abstract: An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.
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4.发明公开公开(公告)号：US20230198152A1
公开(公告)日：2023-06-22
申请号：US18169435
申请日：2023-02-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshiki YAMADA , Michiharu YOKOYAMA
CPC classification number: H01Q9/0414 , H04B1/04 , H01Q1/243 , H04B2001/0408
Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.
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Patent Agency Ranking
公开(公告)号：US20250022816A1
公开(公告)日：2025-01-16
申请号：US18896937
申请日：2024-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takaya NEMOTO , Hideki UEDA , Michiharu YOKOYAMA
IPC: H01L23/66 , H01L23/00 , H01L23/31 , H01L23/498 , H01L23/552 , H01L25/11
Abstract: A radio frequency module comprises a first component, a second component and a pedestal all supported by a first surface. The first component, the second component and pedestal all extend along a first axis perpendicular to the first surface. Along the first axis, the first component is longer than the second component and the pedestal is between the second component and the first surface. A first solder is between the first surface and the first component, a second solder is between the pedestal and the second component, and a third solder is between the first surface and the pedestal. Along a second axis which is parallel to the first surface, a first dimension of the first solder is greater than a second dimension of the second solder, and a third dimension of the third solder is greater than the second dimension.
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公开(公告)号：US20180205155A1
公开(公告)日：2018-07-19
申请号：US15923142
申请日：2018-03-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ryuken MIZUNUMA , Shinichiro BANBA , Michiharu YOKOYAMA , Hideki UEDA , Hideaki YAMADA , Noboru MORIOKA
CPC classification number: H01Q21/0025 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2924/15159 , H01L2924/1532 , H01L2924/1533 , H01Q1/2291 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q21/0087 , H01Q21/062 , H01Q21/065 , H01Q21/067 , H01Q23/00 , H01Q25/00 , H04B7/00 , H05K1/0243
Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.
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公开(公告)号：US20240364022A1
公开(公告)日：2024-10-31
申请号：US18768233
申请日：2024-07-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Michiharu YOKOYAMA , Takaya NEMOTO , Hideki UEDA
CPC classification number: H01Q21/065 , H01Q1/2283 , H01Q21/062
Abstract: A sub-module includes a plurality of electronic components and a first support. Each of the plurality of electronic components includes a plurality of internal terminals. The first support covers and supports the plurality of electronic components to expose the plurality of internal terminals. A first conductive film is disposed on at least a part of the first support. A second support supports the sub-module and supports an antenna. A plurality of external terminals exposed from the second support are connected to the plurality of internal terminals.
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公开(公告)号：US20210359416A1
公开(公告)日：2021-11-18
申请号：US17389592
申请日：2021-07-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshiki YAMADA , Michiharu YOKOYAMA
Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.
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公开(公告)号：US20210028546A1
公开(公告)日：2021-01-28
申请号：US17021069
申请日：2020-09-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshiki YAMADA , Michiharu YOKOYAMA
Abstract: An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion (131) and a flat portion (130) having mutually different normal directions, and a bent portion connecting the flat portion (131) and the flat portion (130) to each other. The flat portion (131) has a protruding portion partially protruding in a direction toward the flat portion (130) along the flat portion (131) from a boundary portion between the bent portion and the flat portion (131). The flat portion (131) and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (131). At least a part of the radiation element is disposed on the protruding portion.
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