公开(公告)号：US20240147623A1

公开(公告)日：2024-05-02

申请号：US18494861

申请日：2023-10-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru ENDO

IPC: H05K1/14

CPC classification number: H05K1/14 ,  H05K2201/047 ,  H05K2201/10143

Abstract: An arrangement is provided reduces deformation induced by vibration movements in electronic devices such as Micro Inertial Measurement systems. The result is achieved by the use and particular arrangement of additional printed circuit boards.

公开(公告)号：US20240079350A1

公开(公告)日：2024-03-07

申请号：US18457664

申请日：2023-08-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru ENDO ,  Sami NURMI

IPC: H01L23/00 ,  B81B7/00 ,  H01L23/24 ,  H01L23/498

CPC classification number: H01L23/562 ,  B81B7/0054 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/3121

Abstract: A packaging arrangement is provided that suppresses stress induced by extreme temperature changes during the process of attaching the electronic component. The arrangement includes adding to the package columnar conductors embedded in a solid support substance.

公开(公告)号：US20190208622A1

公开(公告)日：2019-07-04

申请号：US16265047

申请日：2019-02-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yosuke MATSUSHITA ,  Issei YAMAMOTO ,  Shigeru ENDO ,  Yoshihito OTSUBO

IPC: H05K1/02 ,  H05K1/11 ,  H01G4/232 ,  H01F27/28 ,  H01G4/012 ,  H01G4/30 ,  H05K1/03 ,  H01P3/08 ,  H05K3/46 ,  H01F41/04

CPC classification number: H05K1/0237 ,  H01F17/00 ,  H01F27/2804 ,  H01F41/043 ,  H01F2027/2809 ,  H01G4/012 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01P3/081 ,  H05K1/02 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/46 ,  H05K3/4644 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10734

Abstract: A ceramic electronic component according to the present disclosure includes a ceramic insulator and conductor portions including inner conductors disposed inside the ceramic insulator and outer conductors disposed outside the ceramic insulator, wherein each conductor portion has a surface and a back surface opposite to the surface, and at least one of the conductor portions includes a flat portion in which the conductor thickness is constant, surface corner portions having a round-chamfered shape in the direction from the surface toward the back surface of the inner conductor or the outer conductor, and back surface corner portions having a round-chamfered shape in the direction from the back surface toward the surface of the inner conductor or the outer conductor.

公开(公告)号：US20180277457A1

公开(公告)日：2018-09-27

申请号：US15995534

申请日：2018-06-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru ENDO

IPC: H01L23/28 ,  H01P3/08 ,  H05K9/00

Abstract: A module 1a includes a multilayer wiring board 2, a component 3 that is mounted on a main surface 2a of the multilayer wiring board 2, a sealing-resin layer 4 that is laminated on the main surface 2a of the multilayer wiring board 2, and a resin coating layer 7 that coats a surface of the sealing-resin layer 4. The resin coating layer 7 includes a shield film 5 and outer electrodes 6, and opposite surfaces 6a of the outer electrodes 6 and an opposite surface 5a of the shield film 5 are formed on the same plane. The module 1a can be connected to, for example, an external antenna without using a wiring electrode of a mother substrate, and thus, signal loss can be suppressed.