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公开(公告)号：US20240348209A1
公开(公告)日：2024-10-17
申请号：US18627475
申请日：2024-04-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsurou ASHIDA , Kouhei JITOUSHO , Tomoya ODA , Shohei IMAI
CPC classification number: H03F1/0288 , H03F3/245 , H03F2200/451
Abstract: A radio frequency module includes a carrier amplifier and a peak amplifier. A 90° hybrid circuit is connected to an input end of the carrier amplifier and an input end of the peak amplifier. A coupler is connected to an output end of the carrier amplifier and an output end of the peak amplifier. A control circuit varies a threshold value of a bias voltage of the peak amplifier based on a radio frequency signal input to the 90° hybrid circuit or the carrier amplifier, and a signal indicating a drive level of the carrier amplifier. The carrier amplifier and the peak amplifier are included in an integrated circuit, the control circuit is included in another integrated circuit, and the other integrated circuit is disposed adjacent to the integrated circuit on a carrier amplifier side out of the carrier amplifier and the peak amplifier.
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公开(公告)号：US20240072741A1
公开(公告)日：2024-02-29
申请号：US18489860
申请日：2023-10-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsurou ASHIDA
CPC classification number: H03F3/245 , H04L5/1469 , H03F2200/165 , H03F2200/171 , H03F2200/451
Abstract: A smaller size is achieved by reducing a circuit size and the characteristics of all bands are made satisfactory. A radio-frequency module transmits and receives transmission/reception signals in a first frequency band and transmission/reception signals in a second frequency band lower than the first frequency band by time division duplex communication. A switch allows an output from a filter to be input to a low-noise amplifier upon reception of a signal in the second frequency band and allows an output from a power amplifier to be input to the filter upon transmission of a signal in the second frequency band to thereby share the filter for transmission/reception signals in the second frequency band.
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Patent Agency Ranking
公开(公告)号：US20250047244A1
公开(公告)日：2025-02-06
申请号：US18785004
申请日：2024-07-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsurou ASHIDA , Kensuke TAKIMOTO
Abstract: A power amplification device that includes a substrate having a surface; an integrated circuit including a carrier amplifier and a peak amplifier and disposed on the surface; a carrier balun connected to the carrier amplifier; a peak balun connected to the peak amplifier; and a surface mount device disposed on the surface. Each of the carrier amplifier and the peak amplifier is a pair of differential amplifiers. The substrate includes multiple insulating layers arranged in a stacking direction. An electrode to which the surface mount device is soldered is provided on the surface. In a view from the stacking direction, the carrier balun, the electrode, and the peak balun, which are arranged in a second planar direction, are disposed on one side of the integrated circuit in a first planar direction.
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公开(公告)号：US20240348216A1
公开(公告)日：2024-10-17
申请号：US18633545
申请日：2024-04-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tomoya ODA , Tetsurou ASHIDA , Kouhei JITOUSHO , Shohei IMAI
CPC classification number: H03F3/245 , H03F1/0288 , H03F2200/451
Abstract: A radio frequency that includes a carrier amplifier and a peak amplifier, a 90° hybrid circuit connected to an input end of the carrier amplifier and an input end of the peak amplifier, a coupler connected to an output end of the carrier amplifier and an output end of the peak amplifier, and a control circuit configured to vary a threshold value of a bias voltage of the peak amplifier based on a radio frequency signal input to the 90° hybrid circuit or the carrier amplifier, and a signal indicating a drive level of the carrier amplifier, in which the carrier amplifier and the peak amplifier are included in an integrated circuit, the control circuit is included in an integrated circuit, and the integrated circuit and the integrated circuit are laminated.
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公开(公告)号：US20250022817A1
公开(公告)日：2025-01-16
申请号：US18898846
申请日：2024-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsurou ASHIDA
Abstract: A high-frequency module includes a substrate having a first main surface and a second main surface facing each other and a through-hole that extends through the substrate from the first main surface to the second main surface, a first electronic component, and a second electronic component, and the second electronic component is disposed inside the through-hole of the substrate, the first electronic component is disposed so as to extend over the first main surface of the substrate and the second electronic component, the first electronic component is connected to the first main surface of the substrate with a first connection member interposed therebetween, the second electronic component is connected to the first electronic component with a second connection member interposed therebetween, and a first direct current signal is supplied to the second electronic component through the first connection member, the first electronic component, and the second connection member.
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公开(公告)号：US20240348271A1
公开(公告)日：2024-10-17
申请号：US18633537
申请日：2024-04-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kouhei JITOUSHO , Tetsurou ASHIDA , Tomoya ODA , Shohei IMAI
CPC classification number: H04B1/04 , H01P5/227 , H03F3/24 , H04B2001/0408
Abstract: A radio frequency module includes a carrier amplifier and a peak amplifier. A 90° hybrid circuit is connected to an input end of the carrier amplifier and an input end of the peak amplifier. A coupler is connected to an output end of the carrier amplifier and an output end of the peak amplifier. A control circuit varies a threshold value of a bias voltage of the peak amplifier based on a radio frequency signal input to the 90° hybrid circuit or the carrier amplifier, and a signal indicating a drive level of the carrier amplifier, in which the carrier amplifier and the peak amplifier are included in an integrated circuit. The control circuit is included in an integrated circuit, and the integrated circuit is disposed adjacent to the integrated circuit on a peak amplifier side.
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公开(公告)号：US20240333228A1
公开(公告)日：2024-10-03
申请号：US18621706
申请日：2024-03-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shohei IMAI , Tetsurou ASHIDA
CPC classification number: H03F1/0288 , H03F3/211 , H03G3/3042 , H03G2201/103
Abstract: A Doherty amplifier circuit includes a first integrated circuit and a second integrated circuit connected to the first integrated circuit. One of the first integrated circuit and the second integrated circuit includes a carrier amplifier that amplifies a radio-frequency signal, a peak amplifier that amplifies the radio-frequency signal, a variable gain control circuit that controls a gain of the radio-frequency signal based on a drive level signal that indicates a drive level of the carrier amplifier, and a bias circuit that inputs a bias based on an output from the variable gain control circuit to the peak amplifier. The first integrated circuit on a silicon die includes at least the variable gain control circuit.
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