公开(公告)号：US20170229221A1

公开(公告)日：2017-08-10

申请号：US15494841

申请日：2017-04-24

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yoshiko OKADA ,  Atsushi YAMAMOTO

IPC: H01F1/147 ,  H01F27/245 ,  H01F27/255 ,  H01F27/28

CPC classification number: H01F1/14733 ,  H01F1/344 ,  H01F17/0013 ,  H01F27/245 ,  H01F27/255 ,  H01F27/2804 ,  H01F2017/0093 ,  H01F2027/2809

Abstract: A multilayer coil component including: a magnetic part that contains Fe, Zn, V, and Ni and optionally contains Mn and/or Cu; and a conductor part that contains copper. In the magnetic part, Fe is in an amount of 34.0 to 48.5 mol % expressed as Fe2O3 equivalent, Zn is in an amount of 6.0 to 45.0 mol % expressed as ZnO equivalent, Mn is in an amount of 0 to 7.5 mol % expressed as Mn2O3 equivalent, Cu is in an amount of 0 to 5.0 mol % expressed as CuO equivalent, and V is in an amount of 0.5 to 5.0 mol % expressed as V2O5 equivalent, with respect to the total amount of Fe expressed as Fe2O3 equivalent, Zn expressed as ZnO equivalent, V expressed as V2O5 equivalent, and Ni expressed as NiO equivalent, and optionally present Cu expressed as CuO equivalent and optionally present Mn expressed as Mn2O3 equivalent.

公开(公告)号：US20170229223A1

公开(公告)日：2017-08-10

申请号：US15494965

申请日：2017-04-24

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yoshiko OKADA

IPC: H01F1/34 ,  C04B35/26 ,  C04B35/626 ,  H01F27/29 ,  C04B35/634 ,  C04B35/638 ,  H01F27/245 ,  H01F27/28 ,  C04B35/453 ,  C04B35/64

CPC classification number: H01F1/34 ,  B32B18/00 ,  C04B35/26 ,  C04B35/265 ,  C04B35/2658 ,  C04B35/2666 ,  C04B35/453 ,  C04B35/6261 ,  C04B35/6262 ,  C04B35/6342 ,  C04B35/638 ,  C04B35/64 ,  C04B2235/3239 ,  C04B2235/3265 ,  C04B2235/3268 ,  C04B2235/3274 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3282 ,  C04B2235/3284 ,  C04B2235/6025 ,  C04B2235/612 ,  C04B2235/6567 ,  C04B2235/6583 ,  C04B2235/6588 ,  C04B2235/96 ,  C04B2237/34 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  H01F1/344 ,  H01F3/14 ,  H01F17/0013 ,  H01F27/245 ,  H01F27/2804 ,  H01F27/292 ,  H01F2027/2809

Abstract: A multilayer coil component including a magnetic part formed of a ferrite material, a non-magnetic part formed of a non-magnetic ferrite material, and a coiled conductive part embedded in the magnetic part and the non-magnetic part. The non-magnetic part has an Fe content of 36.0 to 48.5 mol % in terms of Fe2O3, a Zn content of 46.0 to 57.5 mol % in terms of ZnO, a V content of 0.5 to 5.0 mol % in terms of V2O5, a Mn content of 0 to 7.5 mol % in terms of Mn2O3, and a Cu content of 0 to 5.0 mol % in terms of CuO with respect to the sum of the Fe content in terms of Fe2O3, the Zn content in terms of ZnO, the V content in terms of V2O5, and if present, the Cu content in terms of CuO, and the Mn content in terms of Mn2O3.

公开(公告)号：US20140176286A1

公开(公告)日：2014-06-26

申请号：US14192686

申请日：2014-02-27

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yoshiko OKADA ,  Atsushi YAMAMOTO ,  Akihiro NAKAMURA

IPC: H01F17/00 ,  H01F41/04 ,  H01F27/28 ,  H05K3/00

CPC classification number: H01F17/0013 ,  B32B18/00 ,  C04B35/265 ,  C04B35/6342 ,  C04B35/638 ,  C04B2235/3265 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/6025 ,  C04B2235/6567 ,  C04B2235/6584 ,  C04B2235/96 ,  C04B2237/06 ,  C04B2237/68 ,  H01B3/12 ,  H01F1/344 ,  H01F17/0033 ,  H01F27/2804 ,  H01F27/292 ,  H01F41/041 ,  H01F41/046 ,  H05K3/0058 ,  Y10T29/49155

Abstract: A coil conductor and a via electrode placed away from the coil conductor are embedded in a magnetic layer. The magnetic layer is sandwiched between a pair of non-magnetic layers. The coil conductor and the via electrode are formed from a conductive material containing Cu as its main constituent, and the magnetic layer is formed from Ni—Mn—Zn ferrite where the CuO molar content is 5 mol % or less, and (x, y) falls within the range of A (25, 1), B (47, 1), C (47, 7.5), D (45, 7.5), E (45, 10), F (35, 10), G (35, 7.5), and H (25, 7.5) when the molar content x of Fe2O3 and the molar content y of Mn2O3 are represented by (x, y). Thus, insulation properties can be ensured, favorable electrical characteristics can be achieved, and a ceramic electronic component is achieved which is able to be reduced in size.

Abstract translation: 离开线圈导体放置的线圈导体和通孔电极嵌入在磁性层中。 磁性层夹在一对非磁性层之间。 线圈导体和通孔电极由含有Cu作为主要成分的导电材料形成，磁性层由CuO摩尔含量为5摩尔％以下的Ni-Mn-Zn铁氧体形成，（x，y ）属于A（25,1），B（47,1），C（47,7.5），D（45,7.5），E（45,10），F（35,10），G 35，7.5）和H（25,7.5），当Fe2O3的摩尔含量x和Mn 2 O 3的摩尔含量y表示为（x，y）时。 因此，可以确保绝缘性能，可以实现良好的电气特性，并且实现能够减小尺寸的陶瓷电子部件。

公开(公告)号：US20150270056A1

公开(公告)日：2015-09-24

申请号：US14731172

申请日：2015-06-04

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yoshiko OKADA

IPC: H01F27/28 ,  H01F41/04 ,  H01F1/01

CPC classification number: H01F27/2804 ,  H01F1/01 ,  H01F1/36 ,  H01F3/14 ,  H01F17/0013 ,  H01F17/0033 ,  H01F41/04 ,  H01F41/046 ,  H01F2027/2809

Abstract: A laminated coil component that can use inexpensive copper as an internal conductor, and has excellent direct current superimposition characteristics is provided. In a laminated coil component including: a magnetic section including a ferrite material; a non-magnetic section including a non-magnetic ferrite material; and a coiled conductor section containing copper as a main component embedded inside the magnetic section and the non-magnetic section, the non-magnetic section contains at least Fe, Mn and Zn, and optionally Cu. The non-magnetic section has a Fe content of 40.0 mol % to 48.5 mol % in terms of Fe2O3, a Mn content of 0.5 mol % to 9 mol % in terms of Mn2O3 and a Cu content of 8 mol % or less in terms of CuO.

Abstract translation: 提供了可以使用便宜的铜作为内部导体并且具有优异的直流叠加特性的层叠线圈部件。 一种层叠线圈部件，包括：包含铁素体材料的磁性部分; 包括非磁性铁氧体材料的非磁性部分; 以及包含嵌入在磁性部分和非磁性部分内的作为主要组分的铜的线圈导体部分，非磁性部分至少包含Fe，Mn和Zn以及任选的Cu。 非磁性部分的Fe含量以Fe2O3计为40.0mol％至48.5mol％，以Mn2O3计的Mn含量为0.5mol％至9mol％，Cu含量为8mol％或以下的Fe含量为 CuO。

公开(公告)号：US20140312539A1

公开(公告)日：2014-10-23

申请号：US14320765

申请日：2014-07-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiko OKADA ,  Osamu CHIKAGAWA ,  Hidekiyo TAKAOKA ,  Shodo TAKEI

IPC: H05K3/46

CPC classification number: H05K3/4629 ,  H01G2/02 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/186 ,  H05K3/4611 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49155

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract translation: 另外，在芯片型陶瓷部件的陶瓷多层基板中，即使在陶瓷多层基板的表面上安装有芯片型陶瓷部件，也可以将芯片型陶瓷部件与内部导体或表面 陶瓷多层基板的电极大大改善和增加。 陶瓷多层基板包括层叠有多个陶瓷层的陶瓷层叠体，设置在陶瓷层叠体中的内部导体，设置在陶瓷层叠体的上表面的表面电极以及与该陶瓷层叠体接合的芯片型陶瓷构件 内部导体或表面电极通过外部电极。 内部导体或表面电极通过连接电极接合到外部电极，连接电极与内部导体，表面电极和外部电极中的任一个形成固溶体。