公开(公告)号：US11013156B1

公开(公告)日：2021-05-18

申请号：US16994590

申请日：2020-08-15

Applicant: NANOBIT TECH. CO., LTD.

Inventor： Sung-Chien Huang ,  Yu-Yang Chang ,  Hsiou-Ming Liu ,  Ping-Feng Yu

IPC: H05K9/00 ,  C09J9/02 ,  C09J7/29

Abstract: An EMI shielding film includes a flexible composite metal layer, a transparent insulating layer, and a conductive adhesive layer. The conductive adhesive layer is formed by removing a solvent from a conductive adhesive composition. The conductive adhesive composition includes an acrylate solution, a divalent acid ester solution, a plurality of conductive particles, and the solvent. The present disclosure further includes a method of manufacturing the EMI shielding film.