公开(公告)号：US09078331B2

公开(公告)日：2015-07-07

申请号：US13903190

申请日：2013-05-28

Applicant: NATIONAL CENTRAL UNIVERSITY

Inventor： Ching-Cherng Sun ,  Ching-Yi Chen ,  Hsin-Mei Wu ,  Cheng-Chien Chen

IPC: H05B33/14 ,  H05B33/10 ,  H01L33/50 ,  C09K11/77

CPC classification number: H05B33/14 ,  C09K11/7774 ,  H01L33/502 ,  H01L2933/0041 ,  H05B33/10 ,  Y02B20/181

Abstract: A light emitting device is provided to produce white light with a stable correlated color temperature and stable color coordinates. The light emitting device includes a blue LED chip and a yellow phosphor. The blue LED chip has a peak wavelength X slightly smaller than the peak wavelength Y of the phosphor such that when the light emitting device is subjected to a predetermined operating current, the phosphor decays due to thermal effect, and the LED chip has its emission spectrum red-shifted to substantially match with the excitation spectrum of the phosphor. At this time, the excitation ability of the LED chip is increased and causes an increase of yellow power output from the phosphor that substantially compensates a decrease of yellow light output caused by the phosphor.

Abstract translation: 提供发光器件以产生具有稳定的相关色温和稳定色坐标的白光。 发光器件包括蓝色LED芯片和黄色荧光体。 蓝色LED芯片的峰值波长X比荧光体的峰值波长Y稍小，因此当发光元件经受规定的工作电流时，荧光体由于热效应而衰变，LED芯片的发光光谱 红移以与荧光体的激发光谱基本匹配。 此时，LED芯片的激发能力增加，并且导致从荧光体输出的黄色功率的增加，其基本上补偿由磷光体引起的黄光输出的减少。

公开(公告)号：US08803427B1

公开(公告)日：2014-08-12

申请号：US13892525

申请日：2013-05-13

Applicant: National Central University

Inventor： Ching-Cherng Sun ,  Yu-Yu Chang ,  Ching-Yi Chen

IPC: H05B37/02 ,  F21V7/00

CPC classification number: F21V23/0464 ,  F21Y2113/17 ,  F21Y2115/10 ,  H05B33/0821

Abstract: A LED package structure includes a base; at least one main light chip assembled to the base; a plurality of sub light chips assembled to the base; a wavelength shifter assembled to the base, the wavelength shifter located above each main light chip and each sub light chip, the wavelength shifter configured to shift a wavelength of each light beam from each main light chip; an outer lens assembled to the base and located above the wavelength shifter, so as to package each main light chip, each sub light chip and the wavelength shifter, the outer lens improving a light extraction efficiency of the light beams; and a controlling member electrically connected to each main light chip and each sub light chip, the controlling member configured to control luminance of each main light chip and luminance of each sub light chip.

Abstract translation: LED封装结构包括基座; 至少一个主芯片组装到基座上; 组装到基座的多个子光芯片; 波长移动器组装到基座，波长移位器位于每个主光芯片和每个子光芯片上，波长移位器被配置为从每个主光芯片移位每个光束的波长; 组合到基座并位于波长移位器上方的外透镜，以便封装每个主光芯片，每个子光芯片和波长移位器，外透镜提高光束的光提取效率; 以及控制构件，其电连接到每个主光芯片和每个子光芯片，所述控制构件被配置为控制每个主光芯片的亮度和每个子光芯片的亮度。