公开(公告)号：US20190048137A1

公开(公告)日：2019-02-14

申请号：US15826861

申请日：2017-11-30

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： WEN-CHIUNG SU ,  CHING-HSUAN LIN ,  WEI-FENG HSIAO ,  HAN-YA LIN

IPC: C08G65/48 ,  C08G65/40 ,  C08G59/40 ,  H05K1/03

CPC classification number: C08G65/48 ,  C08G59/4071 ,  C08G65/4012 ,  C08G2650/02 ,  C08G2650/40 ,  C08G2650/64 ,  H05K1/0326 ,  H05K1/0353 ,  H05K2201/012

Abstract: A low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether and a method of producing the same are introduced. Incorporation of a phosphorus group and a DCPD derivative into a low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether enable the DCPD-derived polyether to not only serve as an epoxy resin curing agent but also cure itself such that the cured product not only features satisfactory thermal properties and low-k characteristics but is also non-flammable.

公开(公告)号：US20160137786A1

公开(公告)日：2016-05-19

申请号：US14546481

申请日：2014-11-18

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： WEN-CHIUNG SU ,  CHING-HSUAN LIN ,  SHENG-CHEN LIAO ,  YU-WEI CHOU

IPC: C08G73/06

CPC classification number: C08G73/0644 ,  C08G14/06 ,  C08L61/34 ,  C08L79/04

Abstract: A copolymer of DCPD-containing benzoxazine (DCPDBz) and cyanate ester resin forms a low-dielectric thermosetting polymeric material for making electronic components. A method of manufacturing the copolymer is also introduced. The method includes allowing DCPD-phenol oligomer, aniline, and paraformaldehyde to react at 110° C. for 6-12 hours before being extracted and baked to obtain DCPDBz; and mixing cyanate ester and the DCPDBz at 150° C.; heating the mixture up to 220° C.

Abstract translation: 含DCPD的苯并恶嗪（DCPDBz）和氰酸酯树脂的共聚物形成用于制造电子部件的低介电热固性聚合物材料。 还引入了共聚物的制造方法。 该方法包括使得DCPD-苯酚低聚物，苯胺和多聚甲醛在110℃下反应6-12小时，然后提取和烘焙得到DCPDBz; 并在150℃下混合氰酸酯和DCPDBz; 将混合物加热至220℃