DATA CENTER RACK MOUNTED LIQUID CONDUCTION COOLING APPARATUS AND METHOD

    公开(公告)号:US20190150317A1

    公开(公告)日:2019-05-16

    申请号:US15810018

    申请日:2017-11-11

    Abstract: Embodiments disclosed include a liquid-cooled cooling apparatus comprising a cooling structure comprising a first heat transfer element mounted to the electronics rack, and in operative communication with a thermally conductive material comprising at least one coolant-carrying channel extending there through in a closed loop. The liquid-cooled cooling apparatus further comprises a second heat transfer element coupled to the first heat transfer element and in operative communication with a thermally conductive material comprising at least one coolant-carrying channel extending there through in at least one of an open loop and a closed loop. The apparatus optionally includes a plurality of heat transfer elements, each heat transfer element being coupled to one or more heat-generating components of a respective electronic system of a plurality of electronic systems, and wherein each heat transfer element provides a thermal transport path from the one or more heat-generating components of the respective electronic system.

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