公开(公告)号：US20220254548A1

公开(公告)日：2022-08-11

申请号：US17555775

申请日：2021-12-20

Applicant: NEXANS

Inventor： Markus JARVID ,  Simon JORGENSEN

IPC: H01B7/282 ,  B32B15/08 ,  B32B7/12 ,  B32B27/20 ,  C08L67/02 ,  C08L23/06 ,  H01B7/18

Abstract: The present invention relates to a laminate water barrier which is capable of conducting capacitive currents radially out of the cable thus avoiding breakdown due to induced voltage gradients, comprising a laminate structure comprising a metal foil having a lower and an upper surface area, a first layer of a thermoplastic polymer laid onto and covering the lower surface of the layer of metal foil except for a longitudinal uncovered surface area of the layer of metal foil, and a second layer of thermo-plastic polymer laid onto and covering the upper surface of the layer of metal foil except for a longitudinal uncovered surface area of the layer of metal foil, and wherein the laminate structure is wrapped around the cable core such that the first uncovered surface area of the metal foil faces the cable core and the second uncovered surface area of the metal foil faces away from the laminate structure, and the laminate structure is thermally joined by a heat treatment.

公开(公告)号：US20220189659A1

公开(公告)日：2022-06-16

申请号：US17547358

申请日：2021-12-10

Applicant: NEXANS

Inventor： Massimiliano MAURI ,  Simon JORGENSEN ,  Knut Magne FURUHEIM ,  Bettina GRORUD ,  Markus JARVID ,  Audun JOHANSON

IPC: H01B7/282 ,  H01B7/14

Abstract: A lead-free water barrier suited for dynamical submarine high voltage power cables has a water barrier including a laminate structure. The laminate structure has a metal foil having a lower and an upper surface area. A first layer of a thermoplastic semiconducting polymer is laid onto the first adhesive layer, and a second layer of a thermoplastic semiconducting polymer is laid onto the second adhesive layer. The laminate structure is thermally joined by a heat treatment.