公开(公告)号：US20240213052A1

公开(公告)日：2024-06-27

申请号：US18520954

申请日：2023-11-28

Applicant: NGK INSULATORS, LTD.

Inventor： Hideaki HASHIMOTO ,  Masashi ONO ,  Michihiro ASHIDA

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67103 ,  H01L21/6833

Abstract: A plug includes a plug body, a spiral gas flow path that is provided in the plug body and that extends from a lower surface of the plug body to an upper surface, and at least one branch path that branches from a position on the spiral gas flow path and that opens on an outer circumferential surface of the plug body or that is in communication with another spiral gas flow path that differs from the spiral gas flow path and that extends from a lower surface of the plug body to an upper surface.

公开(公告)号：US20240213082A1

公开(公告)日：2024-06-27

申请号：US18526061

申请日：2023-12-01

Applicant: NGK INSULATORS, LTD.

Inventor： Hideaki HASHIMOTO ,  Masashi ONO ,  Michihiro ASHIDA

IPC: H01L21/687 ,  H01J37/32

CPC classification number: H01L21/68785 ,  H01J37/32715 ,  H01L21/68757 ,  H01J2237/20235

Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate that has an upper surface that includes a wafer placement portion, and a plug that is installed in a plug installation hole extending through the ceramic plate in an up-down direction and that allows gas to pass therethrough, wherein the plug has a gas flow path that includes a plurality of linear flow paths that is combined such that the plurality of linear flow paths intersects with each other in a plug body, and wherein the gas flow path includes a plurality of opening portions in an upper surface and a lower surface of the plug body.