公开(公告)号：US08933342B2

公开(公告)日：2015-01-13

申请号：US13624310

申请日：2012-09-21

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Kenji Suzuki ,  Masanori Kito ,  Yuma Otsuka ,  Hisayoshi Kamiya ,  Tsuyoshi Tanabashi

IPC: H05K1/16 ,  H05K1/02 ,  H05K3/24 ,  H05K1/03

CPC classification number: H05K1/0246 ,  H05K1/0251 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/242 ,  H05K2201/0317

Abstract: A wiring substrate includes a substrate main body having a first main face and a second main face opposite the first main face; a resistor formed on the first main face; a plurality of first-main-face-side wiring layers which are each formed on the resistor and which each include a grounding metal layer formed of a metal having a resistance lower than that of the resistor and a conductor layer formed on the grounding metal layer; a second-main-face-side wiring layer formed on the second main face; and a via which is formed in the substrate main body and which establishes electrical connectivity between the first-main-face-side wiring layers and the second-main-face-side wiring layer. The wiring substrate further includes a conductive covering layer which covers an upper surface and substantially covers the side surfaces of each of the first-main-face-side wiring layers.

Abstract translation: 布线基板包括具有第一主面和与第一主面相对的第二主面的基板主体; 形成在所述第一主面上的电阻器; 多个第一主面侧布线层，分别形成在电阻器上，并且各自包括由电阻低于电阻器的电阻的金属形成的接地金属层和形成在接地金属层上的导体层 ; 形成在第二主面上的第二主面侧配线层; 以及形成在基板主体中并且建立第一主面侧布线层和第二主面侧布线层之间的电连通性的通孔。 布线基板还包括覆盖上表面并且基本上覆盖每个第一主面侧布线层的侧表面的导电覆盖层。