公开(公告)号：US20140186980A1

公开(公告)日：2014-07-03

申请号：US14138899

申请日：2013-12-23

Applicant: NICHIA CORPORATION

Inventor： Takayuki IGARASHI ,  Satoshi SHIRAHAMA

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/52

CPC classification number: H01L33/50 ,  H01L33/52 ,  H01L2933/0025 ,  H01L2933/0041

Abstract: A method of manufacturing a light emitting device, using a spray coating method, a fluorescent material can be easily adhered on corner portions and side surfaces of an LED chip, a lens-shaped light transmissive resin member surface, an optical lens surface, etc., and a spray coating machine used in the method. The method includes mounting an LED chip on a substrate member, applying a spray coating to a coating object including the LED chip by spraying a powder-containing solution. The applying a spray coating is performed such that a powder-containing solution is sprayed through a solution nozzle arranged above the coating object, as a spray direction of the powder-containing solution indicating a central axis, while using at least one gas nozzle arranged in a surrounding relationship to the central axis, spraying a gas toward the central axis to alter the direction of the spray made of the powder-containing solution.

Abstract translation: 使用喷涂法制造荧光体的发光装置的制造方法可以容易地粘附在LED芯片，透镜状透光树脂构件表面，光学透镜表面等的角部和侧面上。 ，以及该方法中使用的喷涂机。 该方法包括将LED芯片安装在基板部件上，通过喷射含粉末溶液将喷涂施加到包括LED芯片的涂布对象物上。 进行喷雾涂布，使得含粉末溶液通过布置在涂布对象上方的溶液喷嘴喷射，作为指示中心轴的含粉末溶液的喷射方向，同时使用至少一个气体喷嘴，其布置在 与中心轴线的周围关系，向中心轴线喷射气体以改变由含粉末溶液形成的喷雾的方向。

公开(公告)号：US20130267050A1

公开(公告)日：2013-10-10

申请号：US13910245

申请日：2013-06-05

Applicant: Nichia Corporation

Inventor： Satoshi SHIRAHAMA

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L33/62 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49429 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/4554

Abstract: Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.

Abstract translation: 本发明提供一种半导体装置及半导体装置的制造方法，其中半导体装置具有半导体元件，该半导体元件具有多个导线，该多个导线以足够的接合可靠性与半导体元件结合，并具有良好的散热性能。 一种半导体器件，其中第一线被球接在电极上，并且第二线还被接合在球形接合的第一线上，并且第一线或第二线的端部在其自身和球部之间限定空间 的第一根线。

公开(公告)号：US20160197249A1

公开(公告)日：2016-07-07

申请号：US15041897

申请日：2016-02-11

Applicant: Nichia Corporation

Inventor： Takashi SATO ,  Satoshi SHIRAHAMA

IPC: H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/502 ,  C09K11/02 ,  C09K11/7774 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05B33/04 ,  H05B33/10 ,  H01L2924/00014

Abstract: A method for manufacturing a light emitting device having a light emitting element and a resin layer containing fluorescent material particles and a filler which reflects light comprises a fluorescent material precipitation process for precipitating the fluorescent material particles in advance of the filler. A light emitting device comprises a base body; a light emitting element mounted on an upper surface of the base body via a mounting portion; and a sealing resin for sealing the light emitting element. The sealing resin comprises: a fluorescent material-containing first layer for covering the light emitting element on and above the mounting portion, a fluorescent material-containing second layer formed on an upper surface of the base body around the mounting portion, and a filler-containing layer formed on the fluorescent material-containing second layer around the mounting portion.

公开(公告)号：US20160190395A1

公开(公告)日：2016-06-30

申请号：US14975860

申请日：2015-12-21

Applicant: NICHIA CORPORATION

Inventor： Satoshi SHIRAHAMA

IPC: H01L33/44 ,  H01L33/20 ,  H01L33/60

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2933/0033 ,  H05K3/3431 ,  H05K2201/10106 ,  H05K2201/10234 ,  Y02P70/613

Abstract: A light emitting device includes a light emitting element, a light-reflecting substrate, and an electrically conductive member. The light emitting element includes a first surface and an electrode provided on the first surface. The light-reflecting substrate has a first main surface facing the first surface of the light emitting element and has a second main surface opposite to the first main surface. The light-reflecting substrate defines a hole at a position corresponding to the electrode. The hole penetrates through the light-reflecting substrate from the first main surface to the second main surface. The electrically conductive member includes a substantially spherical core arranged in the hole and bonded with the electrode, and a coating portion provided in a space between the substantially spherical core and a lateral surface of the hole.

Abstract translation: 发光装置包括发光元件，光反射基板和导电构件。 发光元件包括设置在第一表面上的第一表面和电极。 光反射基板具有面向发光元件的第一表面的第一主表面，并且具有与第一主表面相对的第二主表面。 光反射基板在与电极对应的位置处形成孔。 孔从第一主表面穿过光反射基板到第二主表面。 导电构件包括布置在孔中并与电极结合的基本上球形的芯，以及设置在基本上球形的芯和孔的侧表面之间的空间中的涂覆部分。

公开(公告)号：US20220140211A1

公开(公告)日：2022-05-05

申请号：US17512328

申请日：2021-10-27

Applicant: NICHIA CORPORATION

Inventor： Satoshi SHIRAHAMA

IPC: H01L33/60 ,  H01L27/15

Abstract: A light emitting device includes a substrate, a reflective resin layer, and a light emitting element. The reflective resin layer is disposed on the substrate and contains a first reflective material and a first resin. The reflective resin layer including first flat part having a first thickness, a second flat part having a second thickness smaller than the first thickness, and a protruded part having a third thickness larger than the first thickness. The light emitting element is disposed on the second flat part of the reflective resin layer, with a portion of a lateral face of the protruded part of the reflective resin layer being in contact with a portion of a lateral face of the light emitting element.

公开(公告)号：US20150153034A1

公开(公告)日：2015-06-04

申请号：US14546042

申请日：2014-11-18

Applicant: NICHIA CORPORATION

Inventor： Hiroshi MIYAIRI ,  Takayuki IGARASHI ,  Masato FUJITOMO ,  Satoshi SHIRAHAMA

IPC: F21V29/503 ,  F21V23/02 ,  F21V19/00 ,  F21V29/70

CPC classification number: F21V19/003 ,  F21V19/0055 ,  F21V29/505 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012

Abstract: A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.

Abstract translation: 发光装置具有多个发光元件，其上安装有多个发光元件的散热构件，具有底面，具有包括侧壁和底壁的凹部的绝缘构件，顶部 所述底壁的表面与所述散热构件的底面接触;以及电路板，具有设置在所述散热构件上并向所述多个发光元件供电的电路。