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公开(公告)号：US20210249573A1
公开(公告)日：2021-08-12
申请号：US16973280
申请日：2019-06-06
Applicant: NIKKISO CO., LTD.
Inventor： Hiroyasu ICHINOKURA , Tadaaki MAEDA , Kazuyoshi SAKURAGI
Abstract: A semiconductor light-emitting device includes a semiconductor light-emitting element having a supporting substrate and a sealing member located above the supporting substrate, a mounting substrate on which the semiconductor light-emitting element is mounted in such a manner that the sealing member faces the mounting substrate, and a sealing part that integrally covers a part of the supporting substrate and a side surface of the sealing member and seals the semiconductor light-emitting element and the mounting substrate.
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