公开(公告)号：US20230389179A1

公开(公告)日：2023-11-30

申请号：US18323131

申请日：2023-05-24

Applicant: NITTO DENKO CORPORATION

Inventor： Kazutoshi KINOSHITA ,  Hayato TAKAKURA ,  Ryosuke SASAOKA

IPC: H05K1/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00

CPC classification number: H05K1/14 ,  H05K1/0306 ,  H05K1/05 ,  H05K3/0044 ,  H05K2203/0228

Abstract: Provided is a method for producing a wiring circuit board having excellent transportability. The method for producing a wiring circuit board includes a first step to a third step. In the first step, an assembly sheet is overlapped with a supporting sheet in a thickness direction. The assembly sheet includes a plurality of wiring circuit boards and a supporting portion supporting the plurality of wiring circuit boards. The supporting portion supports the assembly sheet. In the second step, the plurality of wiring circuit boards are separated from the supporting portion by cutting. In the third step, the assembly sheet including the plurality of wiring circuit boards separated from the supporting portion is conveyed, while being supported by the supporting sheet.