公开(公告)号：US20200234686A1

公开(公告)日：2020-07-23

申请号：US16486325

申请日：2017-11-08

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke HOSODA ,  Kai OKAHARA

IPC: G10K11/168 ,  B32B3/26 ,  B32B5/18 ,  B32B27/36 ,  B32B7/14 ,  B32B5/32 ,  B32B27/06

Abstract: Provided is a sound-absorbing material that is thin and lightweight and is excellent in low-frequency sound-absorbing property. The sound-absorbing material of the present invention includes a laminated structure including in this order: a first perforated layer; a first porous layer; a second perforated layer; and a second porous layer, wherein the first perforated layer has a plurality of through-holes in its thickness direction, wherein the second perforated layer has a plurality of through-holes in its thickness direction, and wherein the first perforated layer has a thickness of less than 1 mm.

公开(公告)号：US20200055288A1

公开(公告)日：2020-02-20

申请号：US16486268

申请日：2017-11-08

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke HOSODA ,  Kai OKAHARA

IPC: B32B27/06 ,  B32B3/26 ,  B32B27/36 ,  B32B7/12 ,  B32B5/18 ,  B60C19/00 ,  G10K11/168

Abstract: Provided is a sound-absorbing material that is thin and lightweight and is excellent in low-frequency sound-absorbing property. The sound-absorbing material of the present invention includes a laminated structure including: a perforated layer; and a porous layer, wherein the sound-absorbing material has a plurality of hole portions extending from a surface of the perforated layer opposite to the porous layer to a depth of a length L, provided that the length L satisfies 0