公开(公告)号：US20170294374A1

公开(公告)日：2017-10-12

申请号：US15516723

申请日：2015-11-20

Applicant: NSK Ltd.

Inventor： Shigeru SIMAKAWA ,  Takashi SUNAGA ,  Takaaki SEKINE ,  Teruyoshi KOGURE ,  Ryoichi SUZUKI

IPC: H01L23/50 ,  H01L23/36 ,  H01L23/12 ,  H01L23/00

CPC classification number: H01L23/50 ,  B29C39/10 ,  B62D5/0406 ,  G01R1/203 ,  H01L23/12 ,  H01L23/36 ,  H01L23/367 ,  H01L23/48 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/40 ,  H01L25/072 ,  H01L2924/0002 ,  H02K11/33 ,  H02M7/003 ,  H02M2001/327 ,  H01L2924/00

Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape