公开(公告)号：US20240154300A1

公开(公告)日：2024-05-09

申请号：US18496975

申请日：2023-10-30

Applicant: NXP B.V.

Inventor： Harshitha Thippur Shivamurthy ,  Rabia Syeda ,  Rocío Gabriela Molina Moreno ,  Cristine Aguila Badiao ,  Pieter Lok ,  Adrianus Buijsman ,  Leo van Gemert ,  Maarten Lont ,  Giorgio Carluccio ,  Antonius Johannes Matheus de Graauw

IPC: H01Q1/38 ,  H01Q1/22

CPC classification number: H01Q1/38 ,  H01Q1/2283

Abstract: A system comprising: a waveguide assembly comprising a plurality of waveguides, the plurality of waveguides comprising at least a first waveguide and a second waveguide, and an integrated circuit package, IC package, comprising a plurality of launchers to one or more of transmit signalling to and receive signalling from a respective one of the plurality of waveguides, wherein the waveguide assembly comprises a surface configured to be coupled to the IC package and each of the plurality of waveguides comprises an opening in the surface configured to be aligned with its respective launcher, and wherein each of the openings has a major dimension and a minor dimension, wherein the major dimension is larger than the minor dimension, and wherein the major dimension of at least the opening of the first waveguide is oriented perpendicular to the major dimension of the opening of the second waveguide.

公开(公告)号：US20220231408A1

公开(公告)日：2022-07-21

申请号：US17453199

申请日：2021-11-02

Applicant: NXP B.V.

Inventor： Giorgio Carluccio ,  Michael B. Vincent ,  Maristella Spella ,  Antonius Johannes Matheus de Graauw ,  Harshitha Thippur Shivamurthy

IPC: H01Q1/46 ,  H01Q1/22

Abstract: A package comprising, an integrated circuit, IC, die comprising circuitry configured to generate signalling for transmission to a waveguide and/or receive signalling from a waveguide via a launcher, the die coupled to an interconnect layer extending out from a footprint of the die; and the launcher is formed in a launcher-substrate, separate from the die, the launcher coupled to the die to pass said signalling therebetween by a connection in said interconnect layer, wherein said launcher comprises a launcher element mounted in a first plane within the launcher-substrate and a waveguide-cavity comprising a ground plane arranged opposed to and spaced from the first plane, the waveguide-cavity further defined by at least one side wall extending from the ground plane towards the first plane; and wherein said die and said launcher are at least partially surrounded by mould material of said package.

公开(公告)号：US11777204B2

公开(公告)日：2023-10-03

申请号：US17453199

申请日：2021-11-02

Applicant: NXP B.V.

Inventor： Giorgio Carluccio ,  Michael B. Vincent ,  Maristella Spella ,  Antonius Johannes Matheus de Graauw ,  Harshitha Thippur Shivamurthy

IPC: H01Q1/22 ,  H01Q1/46

CPC classification number: H01Q1/46 ,  H01Q1/2283

Abstract: A package includes an integrated circuit, IC, die having circuitry configured to generate signalling for transmission to a waveguide and/or receive signalling from a waveguide via a launcher. The die is coupled to an interconnect layer extending out from a footprint of the die. The launcher is formed in a launcher-substrate, separate from the die. The launcher is coupled to the die to pass the signalling therebetween by a connection in the interconnect layer. The launcher includes a launcher element mounted in a first plane within the launcher-substrate and a waveguide-cavity including a ground plane arranged opposed to and spaced from the first plane. The waveguide-cavity is further defined by at least one side wall extending from the ground plane towards the first plane. The die and launcher are at least partially surrounded by mould material of the package.