公开(公告)号：US20210239754A1

公开(公告)日：2021-08-05

申请号：US17118828

申请日：2020-12-11

Applicant: NXP B.V.

Inventor： Jan-Peter Schat ,  Abdellatif Zanati ,  Henrik Asendorf ,  Maristella Spella ,  Waqas Hassan Syed ,  Giorgio Carluccio ,  Antonius Johannes Matheus de Graauw

IPC: G01R31/311

Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.

公开(公告)号：US11415626B2

公开(公告)日：2022-08-16

申请号：US17118828

申请日：2020-12-11

Applicant: NXP B.V.

Inventor： Jan-Peter Schat ,  Abdellatif Zanati ,  Henrik Asendorf ,  Maristella Spella ,  Waqas Hassan Syed ,  Giorgio Carluccio ,  Antonius Johannes Matheus de Graauw

IPC: G01R31/311

Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.

公开(公告)号：US11635461B2

公开(公告)日：2023-04-25

申请号：US17115236

申请日：2020-12-08

Applicant: NXP B.V.

Inventor： Abdellatif Zanati ,  Henrik Asendorf ,  Jan-Peter Schat ,  Nicolas Lamielle

IPC: G01R31/311 ,  H01P3/12 ,  H01Q1/22

Abstract: A test apparatus and method for testing a semiconductor device. The semiconductor device includes an integrated circuit and a plurality of external radiating elements located at a surface of the device. The external radiating elements include at least one transmit element and receive element. The test apparatus includes a plunger. The plunger includes a dielectric portion having a surface for placing against the surface of the device. The plunger also includes at least one waveguide. Each waveguide extends through the plunger for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the device. The dielectric portion is configured to provide a matched interface for the electromagnetic coupling of the waveguide openings to the plurality of external radiating elements of the device.

公开(公告)号：US20240402244A1

公开(公告)日：2024-12-05

申请号：US18204601

申请日：2023-06-01

Applicant: NXP B.V.

Inventor： Giorgio Carluccio ,  Björn Christian Brands ,  Henrik Asendorf

IPC: G01R31/28

Abstract: A two-stage test process for testing IC packages having integrated launchers includes a first stage in which an RF-accurate test process is used to perform RF-accurate tests on a sample set of IC packages to obtain RF-accurate test results and a loop-back test process is performed to obtain loop-back test results. Test characterization data is obtained by comparing the RF-accurate test results to the loop-back test results. In a second stage, larger-scale testing is performed solely with the loop-back test process, and the loop-back test results for each tested IC package are compared with the test characterization data to characterize the test operation of the tested IC package. The loop-back test process can employ a test jig employing a PCB-mounted or PCB-integrated loop-back structure for relatively rapid test setup and test processing.

公开(公告)号：US20210239753A1

公开(公告)日：2021-08-05

申请号：US17115236

申请日：2020-12-08

Applicant: NXP B.V.

Inventor： Abdellatif Zanati ,  Henrik Asendorf ,  Jan-Peter Schat ,  Nicolas Lamielle

IPC: G01R31/311 ,  H01Q1/22 ,  H01P3/12

Abstract: A test apparatus and method for testing a semiconductor device. The semiconductor device includes an integrated circuit and a plurality of external radiating elements located at a surface of the device. The external radiating elements include at least one transmit element and receive element. The test apparatus includes a plunger. The plunger includes a dielectric portion having a surface for placing against the surface of the device. The plunger also includes at least one waveguide. Each waveguide extends through the plunger for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the device. The dielectric portion is configured to provide a matched interface for the electromagnetic coupling of the waveguide openings to the plurality of external radiating elements of the device.