公开(公告)号：US20240407140A1

公开(公告)日：2024-12-05

申请号：US18585384

申请日：2024-02-23

Applicant: Nexalus Limited

Inventor： Richard Jenkins ,  Michel Lebon ,  Anthony Robinson ,  Cathal Wilson ,  Sara Battaglioli

IPC: H05K7/20

Abstract: A sealed server unit is described. The server unit utilises a combination of air and liquid cooling to effect a cooling of the electronic components within the server unit. By sealing the unit to ambient conditions it is possible to deploy the server unit in non-traditional environments.

公开(公告)号：US20240407139A1

公开(公告)日：2024-12-05

申请号：US18204029

申请日：2023-05-31

Applicant: Nexalus Limited

Inventor： Richard Jenkins ,  Michel Lebon ,  Anthony Robinson ,  Cathal Wilson

IPC: H05K7/20 ,  H01L23/473

Abstract: A sealed server unit is described. The server unit utilises a combination of air and liquid cooling to effect a cooling of the electronic components within the server unit. By sealing the unit to ambient conditions it is possible to deploy the server unit in non-traditional environments.

公开(公告)号：US12063756B2

公开(公告)日：2024-08-13

申请号：US18037163

申请日：2021-11-24

Applicant: Nexalus Limited

Inventor： Anthony Robinson ,  Cathal Wilson ,  Kenneth O'Mahony

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20254 ,  G06F1/20 ,  G06F2200/201

Abstract: A modular liquid-cooled thermal heat sink device configured to thermally engage with a thermal substrate. The device comprises a housing assembly having a body defining a volume, the housing assembly comprising a thermal cooling plate configured to be in thermal contact with the thermal substrate, a fluid inlet and a fluid outlet, the housing assembly being configured to facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate, the body comprising a plurality of first engaging features spaced about a perimeter of the body. The device further comprises a plurality of removable arms each comprising a first and second end, each of the plurality of arms being configured to mate with the body at a respective one of the plurality of first engaging features, wherein each of the first ends defines a second engaging feature dimensioned to cooperate and form an engagement with a respective first engaging feature, and wherein each of the second ends is configured to effect an operative fixing of the device to a supporting surface through application of a force on each of the second ends, the force being perpendicular to the supporting surface.

公开(公告)号：US12274024B2

公开(公告)日：2025-04-08

申请号：US18017727

申请日：2021-07-07

Applicant: Nexalus Limited

Inventor： Anthony Robinson ,  Cathal Wilson ,  Kenneth O'Mahony

IPC: H05K7/20 ,  G06F1/20

Abstract: A cooling device for cooling electronic components comprising a primary electronic component, and one or more secondary electronic components of a circuit board is provided. The cooling device comprises a first cooling component. The first cooling component comprises a first cooling member configured to contact a surface of the primary electronic component. The first cooling member is configured to be in fluid communication with a fluid to effect an operative convection cooling of the surface of the primary electronic component. The cooling device further comprises a second cooling component. The second cooling component comprises a second cooling member configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components. The second cooling member is thermally coupled to the first cooling member.

公开(公告)号：US20230328920A1

公开(公告)日：2023-10-12

申请号：US18037163

申请日：2021-11-24

Applicant: Nexalus Limited

Inventor： Anthony Robinson ,  Cathal Wilson ,  Kenneth O'Mahony

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20254 ,  G06F1/20 ,  G06F2200/201

Abstract: A modular liquid-cooled thermal heat sink device configured to thermally engage with a thermal substrate. The device comprises a housing assembly having a body defining a volume, the housing assembly comprising a thermal cooling plate configured to be in thermal contact with the thermal substrate, a fluid inlet and a fluid outlet, the housing assembly being configured to facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate, the body comprising a plurality of first engaging features spaced about a perimeter of the body. The device further comprises a plurality of removable arms each comprising a first and second end, each of the plurality of arms being configured to mate with the body at a respective one of the plurality of first engaging features, wherein each of the first ends defines a second engaging feature dimensioned to cooperate and form an engagement with a respective first engaging feature, and wherein each of the second ends is configured to effect an operative fixing of the device to a supporting surface through application of a force on each of the second ends, the force being perpendicular to the supporting surface.

公开(公告)号：US20230254995A1

公开(公告)日：2023-08-10

申请号：US18017727

申请日：2021-07-07

Applicant: Nexalus Limited

Inventor： Anthony Robinson ,  Cathal Wilson ,  Kenneth O'Mahony

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20254 ,  H05K7/20436 ,  G06F1/20 ,  G06F2200/201

Abstract: A cooling device for cooling electronic components comprising a primary electronic component, and one or more secondary electronic components of a circuit board is provided. The cooling device comprises a first cooling component. The first cooling component comprises a first cooling member configured to contact a surface of the primary electronic component. The first cooling member is configured to be in fluid communication with a fluid to effect an operative convection cooling of the surface of the primary electronic component. The cooling device further comprises a second cooling component. The second cooling component comprises a second cooling member configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components. The second cooling member is thermally coupled to the first cooling member.