METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF INSPECTING PRINTED CIRCUIT BOARD
    1.
    发明申请
    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF INSPECTING PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板的制造方法和检查印刷电路板的方法

    公开(公告)号:US20160266050A1

    公开(公告)日:2016-09-15

    申请号:US15057621

    申请日:2016-03-01

    Inventor: Yoshihiro TOYODA

    Abstract: A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.

    Abstract translation: 第一印刷电路板的基底绝缘层和覆盖绝缘层由第一绝缘材料形成,第二印刷电路板的基底绝缘层和覆盖绝缘层由第二绝缘材料形成。 在第一印刷电路板的检查期间,第一印刷电路板用具有第一波长范围内的峰值波长的第一光照射,并且基于来自第一印刷电路板的反射光产生图像。 在第二印刷电路板的检查期间,用与第一波长区域不同的第二波长区域具有峰值波长的第二光照射第二印刷电路板,并且基于来自第二印刷电路板的反射光产生图像 。

    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF INSPECTING PRINTED CIRCUIT BOARD
    2.
    发明申请
    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF INSPECTING PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板的制造方法和检查印刷电路板的方法

    公开(公告)号:US20160270274A1

    公开(公告)日:2016-09-15

    申请号:US15057771

    申请日:2016-03-01

    Inventor: Yoshihiro TOYODA

    Abstract: A printed circuit board is fabricated in a manufacturing process. In an inspection process, first and second light sources of an inspection device irradiate the printed circuit board with first and second light having first and second wavelength distributions. First and second imaging devices produce a monochromatic first image and a color second image of an inspection subject region of the printed circuit board based on the first and second light respectively reflected by the printed circuit board. Presence and absence of a defect is determined based on at least the first image by automatic optical inspection. Further, verification of the defect is performed by visual observation of at least the second image.

    Abstract translation: 在制造过程中制造印刷电路板。 在检查过程中,检查装置的第一和第二光源用具有第一和第二波长分布的第一和第二光照射印刷电路板。 第一和第二成像装置基于由印刷电路板反射的第一和第二光产生印刷电路板的检查对象区域的单色第一图像和彩色第二图像。 基于至少第一图像通过自动光学检查确定缺陷的存在和不存在。 此外,通过目视观察至少第二图像来进行缺陷的验证。

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