公开(公告)号：US20020064029A1

公开(公告)日：2002-05-30

申请号：US09725643

申请日：2000-11-29

Applicant: Nokia Mobile Phones Ltd.

Inventor： Helena Pohjonen

IPC: H05K007/20

CPC classification number: H05K1/0207 ,  H01L23/3677 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K1/141 ,  H05K1/16 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0317 ,  H05K2201/09563 ,  H01L2924/00

Abstract: Stacked substrates using passive integration components formed in silicon or stainless steel substrates interconnect with active elements mounted on the surface of the substrate to form a miniaturized power amplification module. Metal filled vias pass through the layers and carry electrical signals to and from the active elements and passive components. The metal filled vias function as thermal transfer heat sinks to transfer heat away from the active elements and the module.

Abstract translation: 使用在硅或不锈钢衬底中形成的无源集成元件的堆叠衬底与安装在衬底表面上的有源元件互连以形成小型化的功率放大模块。 金属填充的通孔穿过层并将电信号传送到有源元件和无源元件。 金属填充的通孔用作热转印散热器，以将热量从有源元件和模块传送出去。