VAPOUR CHAMBER
    3.
    发明申请

    公开(公告)号:US20220026961A1

    公开(公告)日:2022-01-27

    申请号:US17383841

    申请日:2021-07-23

    Abstract: Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

    TUNING RADIO FREQUENCY ELEMENTS
    4.
    发明申请

    公开(公告)号:US20210391751A1

    公开(公告)日:2021-12-16

    申请号:US17321762

    申请日:2021-05-17

    Abstract: Aspects of the present disclosure may relate to an apparatus, a method, and non-transitory computer-readable storage medium configured for tuning radio frequency elements. In some aspects, the aspects may relate to at least one radio frequency element, at least one wireless charging, one or more channels configured to run between a first portion at least substantially adjacent to the at least one wireless charging coil and a second portion at least substantially adjacent to the at least one radio frequency element, and a dielectric fluid disposed within the one or more channels.

    SPEAKER APPARATUS HAVING A HEAT DISSIPATION STRUCTURE

    公开(公告)号:US20190253803A1

    公开(公告)日:2019-08-15

    申请号:US15895382

    申请日:2018-02-13

    Abstract: A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a heat pipe or a heat sink configured to receive heat from a component that generates heat. The heat dissipation structure is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.

    SYSTEM AND METHOD FOR LOCATION DETERMINATION UTILIZING DIRECT PATH INFORMATION

    公开(公告)号:US20220113370A1

    公开(公告)日:2022-04-14

    申请号:US17066057

    申请日:2020-10-08

    Abstract: A system, apparatus, method and computer program product determine the location of a receiver, such as one or more sensors, carried by a device, e.g., a robot. In a method, an audio signal is received in response to a predetermined audio signal provided by at least two audio source devices. For the audio signal that is received from a respective audio source device, the method estimates a first impulse response between the respective audio source device and the receiver. For the first impulse response estimated between each respective audio source device of the at least two audio source devices and the receiver, the method removes one or more reflections from the first impulse response to create direct path information. The method also includes determining a location of the receiver based at least in part upon the direct path information.

    Piezoelectric Speaker
    8.
    发明申请

    公开(公告)号:US20200275215A1

    公开(公告)日:2020-08-27

    申请号:US16287338

    申请日:2019-02-27

    Abstract: An apparatus including a first member; a first array of flexible actuators connected to the first member, where each of the flexible actuators includes a piezoelectric member and an extension on the piezoelectric member; and a first flexible membrane connected to the first array of flexible actuators. Each of the piezoelectric members is configured to be activated to move their respective extensions. Each of the extensions, when moved by their respective piezoelectric members, is configured to move the first flexible membrane.

    AUDIO MIXING FOR DISTRIBUTED AUDIO SENSORS
    9.
    发明申请

    公开(公告)号:US20200177994A1

    公开(公告)日:2020-06-04

    申请号:US16259169

    申请日:2019-01-28

    Inventor: Ian DAVIS

    Abstract: A method, apparatus and computer program product enhance audio quality during a voice communication session, enhancing audio quality for a device of a remote user. The apparatus can comprise a processor, a memory, and a computer program code, and can be configured to receive and weight audio signals based on signal attributes such that audio signals can be adjusted and adjusted signals mixed to form a composite audio signal. In a method, a processor receives audio signals from audio sensors around a room, selects one or more audio signals based on audio signal attributes, and adjusts or causes the adjustment of the one or more audio signals based on the audio signal attributes. The method can also include causing the adjusted audio signals to be mixed to form a composite signal, and causing the composite signal to be communicated to a device of a remote user.

    SPEAKER APPARATUS HAVING A HEAT DISSIPATION STRUCTURE INCLUDING AN ACTIVE ELEMENT

    公开(公告)号:US20190253804A1

    公开(公告)日:2019-08-15

    申请号:US15895441

    申请日:2018-02-13

    Abstract: A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a thermally conductive mesh that at least partially fills the speaker cavity. The heat dissipation structure further includes an active element configured to direct heat generated by a component into the thermally conductive mesh for dissipation therein. The thermally conductive mesh is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.

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