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公开(公告)号:US20210366652A1
公开(公告)日:2021-11-25
申请号:US17324642
申请日:2021-05-19
Applicant: Nokia Technologies Oy
Inventor: Diarmuid O'CONNELL , Akshat AGARWAL , Ian DAVIS , Nicholas JEFFERS
Abstract: A charging apparatus for inductive charging. The charging apparatus comprises one or more charging coils configured to transfer power to a mobile apparatus and at least one flexible diaphragm configured so that movement of the flexible diaphragm directs air flow towards the mobile apparatus. At least one of, the one or more charging coils or actuating circuitry for actuating the one or more charging coils are mounted on the flexible diaphragm
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公开(公告)号:US20230328415A1
公开(公告)日:2023-10-12
申请号:US18023525
申请日:2021-08-06
Applicant: Nokia Technologies Oy
Inventor: Ian DAVIS , Oliver BURNS , Diarmuid O'CONNELL , Akshat AGARWAL , Nicholas JEFFERS
CPC classification number: H04R1/02 , H04R1/08 , H04R1/222 , H04R2201/029 , H04R2499/11
Abstract: A microphone apparatus including: a casing; a composite material located within the casing, the composite material including at least in part conductive particles, the composite material configured to alter an internal impedance based on a surface disturbance transmitted by an acoustic wave, and wherein the microphone apparatus is configured to be coupled to a surface that transmitted the acoustic wave.
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公开(公告)号:US20220026961A1
公开(公告)日:2022-01-27
申请号:US17383841
申请日:2021-07-23
Applicant: Nokia Technologies Oy
Inventor: Nick JEFFERS , Diarmuid O'CONNELL , Ian DAVIS , Akshat AGARWAL , Oliver BURNS
IPC: G06F1/16 , G06F1/20 , H01L23/427 , H05K7/20
Abstract: Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.
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公开(公告)号:US20210391751A1
公开(公告)日:2021-12-16
申请号:US17321762
申请日:2021-05-17
Applicant: Nokia Technologies Oy
Inventor: Diarmuid O'CONNELL , Oliver BURNS , Nicholas JEFFERS , Ian DAVIS , Akshat AGARWAL
Abstract: Aspects of the present disclosure may relate to an apparatus, a method, and non-transitory computer-readable storage medium configured for tuning radio frequency elements. In some aspects, the aspects may relate to at least one radio frequency element, at least one wireless charging, one or more channels configured to run between a first portion at least substantially adjacent to the at least one wireless charging coil and a second portion at least substantially adjacent to the at least one radio frequency element, and a dielectric fluid disposed within the one or more channels.
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公开(公告)号:US20190253803A1
公开(公告)日:2019-08-15
申请号:US15895382
申请日:2018-02-13
Applicant: NOKIA TECHNOLOGIES OY
Inventor: Ian DAVIS , Rudi O'Reilly MEEHAN , Akshat AGARWAL
Abstract: A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a heat pipe or a heat sink configured to receive heat from a component that generates heat. The heat dissipation structure is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.
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公开(公告)号:US20240012094A1
公开(公告)日:2024-01-11
申请号:US18006376
申请日:2021-07-06
Applicant: NOKIA TECHNOLOGIES OY
Inventor: Ian DAVIS , Akshat AGARWAL , Nicholas JEFFERS , Diarmuid O'CONNELL , Oliver BURNS
Abstract: Examples of the disclosure relate to apparatus (101) for positioning mobile devices (105). The apparatus (101) comprises means for: obtaining a time of arrival of at least one audio signal (131) at a mobile device (105), wherein the audio signal (131) is generated with a photoacoustic effect; and using the time of the arrival of the audio signal (131) to estimate a location of the mobile device (105).
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公开(公告)号:US20220113370A1
公开(公告)日:2022-04-14
申请号:US17066057
申请日:2020-10-08
Applicant: NOKIA TECHNOLOGIES OY
Inventor: Ian DAVIS , Walter ETTER , Hong JIANG
IPC: G01S5/24
Abstract: A system, apparatus, method and computer program product determine the location of a receiver, such as one or more sensors, carried by a device, e.g., a robot. In a method, an audio signal is received in response to a predetermined audio signal provided by at least two audio source devices. For the audio signal that is received from a respective audio source device, the method estimates a first impulse response between the respective audio source device and the receiver. For the first impulse response estimated between each respective audio source device of the at least two audio source devices and the receiver, the method removes one or more reflections from the first impulse response to create direct path information. The method also includes determining a location of the receiver based at least in part upon the direct path information.
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公开(公告)号:US20200275215A1
公开(公告)日:2020-08-27
申请号:US16287338
申请日:2019-02-27
Applicant: Nokia Technologies Oy
Inventor: Ian DAVIS , Akshat Agarwal
Abstract: An apparatus including a first member; a first array of flexible actuators connected to the first member, where each of the flexible actuators includes a piezoelectric member and an extension on the piezoelectric member; and a first flexible membrane connected to the first array of flexible actuators. Each of the piezoelectric members is configured to be activated to move their respective extensions. Each of the extensions, when moved by their respective piezoelectric members, is configured to move the first flexible membrane.
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公开(公告)号:US20200177994A1
公开(公告)日:2020-06-04
申请号:US16259169
申请日:2019-01-28
Applicant: Nokia Technologies Oy
Inventor: Ian DAVIS
IPC: H04R3/04 , G10L21/0208 , G10L25/60
Abstract: A method, apparatus and computer program product enhance audio quality during a voice communication session, enhancing audio quality for a device of a remote user. The apparatus can comprise a processor, a memory, and a computer program code, and can be configured to receive and weight audio signals based on signal attributes such that audio signals can be adjusted and adjusted signals mixed to form a composite audio signal. In a method, a processor receives audio signals from audio sensors around a room, selects one or more audio signals based on audio signal attributes, and adjusts or causes the adjustment of the one or more audio signals based on the audio signal attributes. The method can also include causing the adjusted audio signals to be mixed to form a composite signal, and causing the composite signal to be communicated to a device of a remote user.
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公开(公告)号:US20190253804A1
公开(公告)日:2019-08-15
申请号:US15895441
申请日:2018-02-13
Applicant: NOKIA TECHNOLOGIES OY
Inventor: Ian DAVIS , Rudi O'Reilly MEEHAN , Akshat AGARWAL
CPC classification number: H04R9/022 , H04R2499/11 , H05K7/20145 , H05K7/20154 , H05K7/20263 , H05K7/20272
Abstract: A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a thermally conductive mesh that at least partially fills the speaker cavity. The heat dissipation structure further includes an active element configured to direct heat generated by a component into the thermally conductive mesh for dissipation therein. The thermally conductive mesh is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.
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