公开(公告)号：US20230159384A1

公开(公告)日：2023-05-25

申请号：US18154042

申请日：2023-01-13

Applicant: OHARA INC.

Inventor： TOSHITAKA YAGI ,  KOHEI OGASAWARA ,  YUKI MOTOSHIMA ,  REIKA KOJIMA ,  YUTAKA YAMASHITA ,  NAOYUKI GOTO

IPC: C03C21/00 ,  C03C4/18 ,  C03C10/00

CPC classification number: C03C21/002 ,  C03C4/18 ,  C03C10/0018 ,  C03C2204/00

Abstract: To provide a crystallized glass substrate including a surface with a compressive stress layer, in which a stress depth DOLzero of the compressive stress layer, at which the compressive stress is 0 MPa, is 45 to 200 μm, a compressive stress CS on an outermost surface of the compressive stress layer is 400 to 1400 MPa, and CS×DOLzero, which is a product of the compressive stress CS on the outermost surface and the stress depth DOLzero (μm), is 4.8×104 or more.

公开(公告)号：US20210300818A1

公开(公告)日：2021-09-30

申请号：US17266634

申请日：2018-08-09

Applicant: OHARA INC.

Inventor： TOSHITAKA YAGI ,  KOHEI OGASAWARA ,  YUKI MOTOSHIMA ,  REIKA KOJIMA ,  YUTAKA YAMASHITA ,  NAOYUKI GOTO

IPC: C03C21/00 ,  C03C10/00 ,  C03C4/18

Abstract: To provide a crystallized glass substrate including a surface with a compressive stress layer, in which a stress depth DOLzero of the compressive stress layer, at which the compressive stress is 0 MPa, is 45 to 200 μm, a compressive stress CS on an outermost surface of the compressive stress layer is 400 to 1400 MPa, and CS×DOLzero, which is a product of the compressive stress CS on the outermost surface and the stress depth DOLzero(μm), is 4.8×104 or more.

公开(公告)号：US20210163340A1

公开(公告)日：2021-06-03

申请号：US17266997

申请日：2018-08-09

Applicant: OHARA INC.

Inventor： TOSHITAKA YAGI ,  KOHEI OGASAWARA ,  YUKI MOTOSHIMA ,  REIKA KOJIMA ,  YUTAKA YAMASHITA ,  NAOYUKI GOTO

IPC: C03C3/087

Abstract: To provide a crystallized glass substrate including a surface with a compressive stress layer, in which, CS is 400 to 1400 MPa and CT×(T−2×DOLzero)/CS×DOLzero is 0.60 or more, where CS (MPa) denotes a compressive stress on an outermost surface of the compressive stress layer, DOLzero (μm) denotes a stress depth of the compressive stress layer at which the compressive stress is 0 MPa, CT (MPa) denotes a central stress determined by curve analysis, and T (μm) denotes a thickness of the substrate.

公开(公告)号：US20230150865A1

公开(公告)日：2023-05-18

申请号：US18154041

申请日：2023-01-13

Applicant: OHARA INC.

Inventor： TOSHITAKA YAGI ,  KOHEI OGASAWARA ,  YUKI MOTOSHIMA ,  REIKA KOJIMA ,  YUTAKA YAMASHITA ,  NAOYUKI GOTO

IPC: C03C10/00 ,  C03C4/18 ,  C03C21/00

CPC classification number: C03C10/0018 ,  C03C4/18 ,  C03C21/002 ,  C03C2204/00

Abstract: To provide a crystallized glass substrate including a surface with a compressive stress layer, where a stress depth DOLzero of the compressive stress layer, at which the compressive stress is 0 MPa, is 45 to 200 μm, a compressive stress CS on an outermost surface of the compressive stress layer is 400 to 1400 MPa, and a central stress CT determined by using curve analysis is 55 to 300 MPa.

公开(公告)号：US20210230048A1

公开(公告)日：2021-07-29

申请号：US17266111

申请日：2018-08-09

Applicant: OHARA INC.

Inventor： TOSHITAKA YAGI ,  KOHEI OGASAWARA ,  YUKI MOTOSHIMA ,  REIKA KOJIMA ,  YUTAKA YAMASHITA ,  NAOYUKI GOTO

IPC: C03C10/00 ,  C03C4/18 ,  C03C21/00

Abstract: To provide a crystallized glass substrate including a surface with a compressive stress layer, where a stress depth DOLzero of the compressive stress layer, at which the compressive stress is 0 MPa, is 45 to 200 μm, a compressive stress CS on an outermost surface of the compressive stress layer is 400 to 1400 MPa, and a central stress CT determined by using curve analysis is 55 to 300 MPa.

公开(公告)号：US20210163339A1

公开(公告)日：2021-06-03

申请号：US17266996

申请日：2018-08-09

Applicant: OHARA INC.

Inventor： TOSHITAKA YAGI ,  KOHEI OGASAWARA ,  YUKI MOTOSHIMA ,  REIKA KOJIMA ,  YUTAKA YAMASHITA ,  NAOYUKI GOTO

IPC: C03C3/087

Abstract: To provide a crystallized glass substrate including a surface with a compressive stress layer, in which a compressive stress CS (MPa) on an outermost surface of the compressive stress layer is 400 to 1400 MPa, and DOL50%/DOLzero is 0.30 or more, where DOL50% (μm) is a depth at which the value of the compressive stress is 50% of the CS and DOLzero (μm) is a depth at which the value of the compressive stress is 0 MPa.