Solid-state imaging device and imaging apparatus

    公开(公告)号:US09807330B2

    公开(公告)日:2017-10-31

    申请号:US15130222

    申请日:2016-04-15

    Inventor: Jun Aoki

    Abstract: A solid-state imaging device includes a plurality of first photoelectric conversion elements, a plurality of second photoelectric conversion elements different from the plurality of first photoelectric conversion elements, a plurality of storage units, and a control unit. The plurality of storage units store signal charges output only from the plurality of first photoelectric conversion elements. The control unit controls operations of a first mode of outputting first signals based on signal charges output only from the plurality of first photoelectric conversion elements and stored in the plurality of storage units and a second mode of outputting second signals based on signal charges output from the plurality of first photoelectric conversion elements and the plurality of second photoelectric conversion elements without passing through the plurality of storage units.

    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
    2.
    发明申请
    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS 有权
    固态成像装置和成像装置

    公开(公告)号:US20160234452A1

    公开(公告)日:2016-08-11

    申请号:US15130222

    申请日:2016-04-15

    Inventor: Jun Aoki

    Abstract: A solid-state imaging device includes a plurality of first photoelectric conversion elements, a plurality of second photoelectric conversion elements different from the plurality of first photoelectric conversion elements, a plurality of storage units, and a control unit. The plurality of storage units store signal charges output only from the plurality of first photoelectric conversion elements. The control unit controls operations of a first mode of outputting first signals based on signal charges output only from the plurality of first photoelectric conversion elements and stored in the plurality of storage units and a second mode of outputting second signals based on signal charges output from the plurality of first photoelectric conversion elements and the plurality of second photoelectric conversion elements without passing through the plurality of storage units.

    Abstract translation: 固态成像装置包括多个第一光电转换元件,与多个第一光电转换元件不同的多个第二光电转换元件,多个存储单元和控制单元。 多个存储单元存储仅从多个第一光电转换元件输出的信号电荷。 控制单元控制基于仅从多个第一光电转换元件输出并存储在多个存储单元中的信号电荷来输出第一信号的第一模式的操作,以及基于从多个第一光电转换元件输出的信号电荷输出第二信号的第二模式 多个第一光电转换元件和多个第二光电转换元件,而不通过多个存储单元。

    Solid-state imaging device and imaging apparatus
    3.
    发明授权
    Solid-state imaging device and imaging apparatus 有权
    固态成像装置和成像装置

    公开(公告)号:US08987795B2

    公开(公告)日:2015-03-24

    申请号:US13961456

    申请日:2013-08-07

    Inventor: Jun Aoki

    Abstract: A first substrate has a plurality of photoelectric conversion units arranged in two dimensions. A second substrate has a plurality of photoelectric conversion units arranged in two dimensions. A plurality of photoelectric conversion units are arranged in a region of the second substrate corresponding to a region of the first substrate where one photoelectric conversion unit is arranged. The imaging signals based on signal charges stored in the photoelectric conversion units and the light field signals based on signal charges stored in the photoelectric conversion units are read.

    Abstract translation: 第一基板具有二维布置的多个光电转换单元。 第二基板具有以二维布置的多个光电转换单元。 多个光电转换单元布置在与设置有一个光电转换单元的第一基板的区域对应的第二基板的区域中。 读取基于存储在光电转换单元中的信号电荷的成像信号和基于存储在光电转换单元中的信号电荷的光场信号。

    SOLID-STATE IMAGE PICKUP DEVICE
    4.
    发明申请

    公开(公告)号:US20200075660A1

    公开(公告)日:2020-03-05

    申请号:US16674205

    申请日:2019-11-05

    Abstract: A solid-state image pickup device is provided with a two-dimensional pixel array wherein unit pixels are arrayed on a semiconductor substrate, the unit pixels respectively including photoelectric conversion elements configured to convert inputted light into electric signals, and circuit elements configured to read out the electric signals thus converted. The unit pixels are formed in at least one shared well region surrounded by an insulating element isolation region that penetrates the semiconductor substrate from the front surface to the rear surface and isolates the elements from each other. Each shared well region is biased to a predetermined potential via well contact sections of a number that is smaller than that of the unit pixels.

    SOLID-STATE IMAGING DEVICE
    5.
    发明申请

    公开(公告)号:US20200075644A1

    公开(公告)日:2020-03-05

    申请号:US16675410

    申请日:2019-11-06

    Abstract: A solid-state imaging device includes a two-dimensional pixel array in which unit pixels are arranged on a semiconductor substrate, each including a photoelectric conversion element, and a circuit element. When a plurality of adjacent unit pixels are defined as one pixel group set, a plurality of pixel group sets are arranged in the two-dimensional pixel array. In the one pixel group set, a periphery of the one pixel group set is surrounded by an insulating element isolation region that isolates elements in the semiconductor substrate, except for an intermediate portion between two adjacent unit pixels. In the one pixel group set, two adjacent photoelectric conversion elements are arranged so that two floating diffusions respectively connected to the two adjacent photoelectric conversion elements are opposed to each other with the circuit element interposed therebetween. A transistor shared by the one pixel group set is provided in the intermediate portion.

    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
    6.
    发明申请
    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS 有权
    固态成像装置和成像装置

    公开(公告)号:US20160133664A1

    公开(公告)日:2016-05-12

    申请号:US15000788

    申请日:2016-01-19

    Inventor: Jun Aoki

    Abstract: A solid-state imaging device includes a first substrate and a second substrate electrically connected to the first substrate. The first substrate includes a first semiconductor layer and one or more first wiring layers. The second substrate includes a second semiconductor layer and one or more second wiring layers. The first photoelectric conversion element overlaps any of the one or more first wiring layers at all positions on the first photoelectric conversion element in a planar view of the first substrate. The second photoelectric conversion element does not overlap any of the one or more first wiring layers at some positions on the second photoelectric conversion element in the planar view of the first substrate.

    Abstract translation: 固态成像装置包括电连接到第一基板的第一基板和第二基板。 第一衬底包括第一半导体层和一个或多个第一布线层。 第二基板包括第二半导体层和一个或多个第二布线层。 第一光电转换元件在第一基板的平面图中与第一光电转换元件上的所有位置处的一个或多个第一布线层中的任一个重叠。 在第一基板的平面图中,第二光电转换元件不与第二光电转换元件上的某些位置处的一个或多个第一布线层重叠。

    Solid-state imaging device and endoscope system

    公开(公告)号:US10299664B2

    公开(公告)日:2019-05-28

    申请号:US15866633

    申请日:2018-01-10

    Inventor: Jun Aoki

    Abstract: The solid-state imaging device includes a semiconductor layer, an electrode, a wiring layer, a plurality of filters, an input terminal, and a voltage generation circuit. The voltage generation circuit generates a first voltage and a second voltage. The plurality of filters include a first filter and a second filter. The light transmittance of the first filter has a peak in a wavelength range corresponding to blue. The light transmittance of the second filter has a peak at a wavelength of 450 nm or more, and in the second filter, the transmittance of light having a wavelength of 450 nm or less is greater than the minimum value of the transmission of light having a wavelength longer than 450 nm. The first voltage and the second voltage are selectively applied to the electrode.

    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS

    公开(公告)号:US20180166492A1

    公开(公告)日:2018-06-14

    申请号:US15889509

    申请日:2018-02-06

    Inventor: Jun Aoki

    Abstract: A solid-state imaging device includes a first substrate, a second substrate, a plurality of first connectors, and a plurality of second connectors. The plurality of first connectors are configured to transmit a first signal. The plurality of second connectors are configured to transmit a second signal. The first signal has at least two levels, and the levels of the first signal discretely vary between the at least two levels. The second signal is a continuous time signal. A first area of a first region is smaller than a second area of a second region. The first region is a projection region of each of the plurality of first connectors in a principal surface of the first substrate. The second region is a projection region of each of the plurality of second connectors in the principal surface.

    SOLID-STATE IMAGING DEVICE AND ENDOSCOPE SYSTEM

    公开(公告)号:US20180125341A1

    公开(公告)日:2018-05-10

    申请号:US15866633

    申请日:2018-01-10

    Inventor: Jun Aoki

    Abstract: The solid-state imaging device includes a semiconductor layer, an electrode, a wiring layer, a plurality of filters, an input terminal, and a voltage generation circuit. The voltage generation circuit generates a first voltage and a second voltage. The plurality of filters include a first filter and a second filter. The light transmittance of the first filter has a peak in a wavelength range corresponding to blue. The light transmittance of the second filter has a peak at a wavelength of 450 nm or more, and in the second filter, the transmittance of light having a wavelength of 450 nm or less is greater than the minimum value of the transmission of light having a wavelength longer than 450 nm. The first voltage and the second voltage are selectively applied to the electrode.

    SOLID-STATE IMAGE CAPTURE DEVICE AND IMAGE CAPTURE DEVICE
    10.
    发明申请
    SOLID-STATE IMAGE CAPTURE DEVICE AND IMAGE CAPTURE DEVICE 有权
    固态图像捕获设备和图像捕获设备

    公开(公告)号:US20150334330A1

    公开(公告)日:2015-11-19

    申请号:US14809622

    申请日:2015-07-27

    Inventor: Jun Aoki

    Abstract: A solid-state image capture device includes a plurality of pixels and a first substrate and a second substrate in which circuit elements constitutes the pixels are disposed and which are electrically connected by a connection unit. The pixels includes: photoelectric conversion elements disposed in the first substrate and generating signals corresponding to amounts of incident light; sample hold capacities disposed in the second substrate and holding output signals corresponding to the signals generated by the photoelectric conversion elements; and a clamp capacitor disposed in the second substrate, shared by the plurality of pixels, and clamping voltages of the output signals held in the plurality of sample hold capacities. The sample hold capacities and the clamp capacitor are capacities having a structure in which two sheets of metal electrodes having a quadrangular flat plate shape are opposite to each other.

    Abstract translation: 固态图像捕获装置包括多个像素,并且其中电路元件构成像素的第一基板和第二基板被布置并且通过连接单元电连接。 像素包括:设置在第一基板中并产生对应于入射光量的信号的光电转换元件; 样品保持容量设置在第二衬底中并保持对应于由光电转换元件产生的信号的输出信号; 以及设置在所述第二基板中的由所述多个像素共享的钳位电容以及保持在所述多个采样保持容量中的所述输出信号的钳位电压。 样品保持容量和钳位电容器是具有两片四边形平板形状的金属电极彼此相对的结构的容量。

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