公开(公告)号：US11735684B2

公开(公告)日：2023-08-22

申请号：US17283973

申请日：2019-10-10

Applicant: OSRAM GmbH

Inventor： Davide Grosso ,  Thomas Rieger ,  Hans Layer

IPC: H01L33/00 ,  H01L33/46 ,  H01L33/62 ,  H01L33/58

CPC classification number: H01L33/005 ,  H01L33/46 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a light-emitting device may include producing a support having at least one conductor track on a surface of the support. The method may further include producing a reflective coating directly on the at least one conductor track by means of a film transfer method such that the conductor track is substantially covered by the reflective coating and arranging a light-emitting component on or above the reflective coating. The light-emitting component may be electrically conductively connected to the conductor track(s).

公开(公告)号：US20210351317A1

公开(公告)日：2021-11-11

申请号：US17283973

申请日：2019-10-10

Applicant: OSRAM GmbH

Inventor： Davide Grosso ,  Thomas Rieger ,  Hans Layer

IPC: H01L33/00 ,  H01L33/46 ,  H01L33/62

Abstract: A method for manufacturing a light-emitting device may include producing a support having at least one conductor track on a surface of the support. The method may further include producing a reflective coating directly on the at least one conductor track by means of a film transfer method such that the conductor track is substantially covered by the reflective coating and arranging a light-emitting component on or above the reflective coating. The light-emitting component may be electrically conductively connected to the conductor track(s).