公开(公告)号：US20150275373A1

公开(公告)日：2015-10-01

申请号：US14430970

申请日：2013-09-25

Applicant: OSRAM GMBH

Inventor： Klaus-Dieter Bauer ,  Frank Vollkommer ,  Juergen Bauer ,  Philipp Erhard

IPC: C23C16/54 ,  C23C16/44 ,  C23C16/455

CPC classification number: C23C16/545 ,  C23C16/4401 ,  C23C16/45525 ,  C23C16/45536 ,  C23C16/45544 ,  G03F7/16 ,  H01J37/32449 ,  H01J37/32458 ,  H01J37/32761 ,  H01J37/3277 ,  Y10T156/10

Abstract: Various embodiments may relate to a device for coating substrates. The device includes a reaction space element configured to arrange substrate portions of one or more substrates as opposite outer walls of a reaction space, and a material feed element configured to introduce one or more materials into the reaction space for coating surfaces of the substrate portions which are opposite one another in the reaction space. Various embodiments further relate to a method for coating substrates.

Abstract translation: 各种实施例可涉及用于涂覆基底的装置。 该装置包括反应空间元件，其构造成将一个或多个基板的基板部分布置为反作用空间的相对的外壁;以及材料进给元件，其被配置为将一种或多种材料引入反应空间中，以涂覆基板部分的表面 在反应空间中彼此相反。 各种实施例进一步涉及用于涂覆基底的方法。

公开(公告)号：US20150132872A1

公开(公告)日：2015-05-14

申请号：US14397207

申请日：2013-04-26

Applicant: OSRAM GmbH

Inventor： Juergen Bauer ,  Gerhard Doell ,  Klaus-Dieter Bauer ,  Philipp Erhard ,  Frank Vollkommer

IPC: C23C16/455 ,  H01L51/00 ,  H01L51/44 ,  H01L51/52 ,  H01L51/56

CPC classification number: C23C16/45525 ,  C23C16/407 ,  C23C16/455 ,  C23C16/45551 ,  C23C16/545 ,  H01L21/02565 ,  H01L21/0262 ,  H01L51/0002 ,  H01L51/0021 ,  H01L51/0096 ,  H01L51/44 ,  H01L51/441 ,  H01L51/448 ,  H01L51/5206 ,  H01L51/5221 ,  H01L51/5237 ,  H01L51/5256 ,  H01L51/5262 ,  H01L51/56 ,  H01L2224/16 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Various embodiments may relate to a device for the surface treatment of a substrate, including a processing head, which is mounted rotatably about an axis of rotation, and which comprises multiple gas outlets, which are at least partially implemented on a radial outer edge of the processing head.

Abstract translation: 各种实施例可以涉及用于表面处理基板的装置，包括可围绕旋转轴线可旋转地安装的处理头，并且包括多个气体出口，其至少部分地实现在 加工头。