公开(公告)号：US10203074B2

公开(公告)日：2019-02-12

申请号：US15593150

申请日：2017-05-11

Applicant: OSRAM GmbH

Inventor： Siegfried Herrmann ,  Markus Pindl

IPC: F21V21/00 ,  F21S4/00 ,  F21K9/69 ,  F21V5/04 ,  H01L25/075 ,  H01L33/48 ,  F21Y113/17 ,  F21Y115/10 ,  H01L33/54 ,  H01L33/60

Abstract: A light-emitting diode and a light module are disclosed. In an embodiment the light-emitting diode includes at least one light-emitting diode chip and a first optical element, which is reflective for light generated by the at least one light-emitting diode chip during operation, wherein the first optical element completely covers at least one of the at least one light-emitting diode chip in a plan view.

公开(公告)号：US20170328525A1

公开(公告)日：2017-11-16

申请号：US15593150

申请日：2017-05-11

Applicant: OSRAM GmbH

Inventor： Siegfried Herrmann ,  Markus Pindl

IPC: F21K9/69 ,  F21V5/04 ,  H01L33/54 ,  H01L33/48 ,  H01L25/075 ,  H01L33/60 ,  F21Y2115/10 ,  F21Y2113/17

CPC classification number: F21K9/69 ,  F21V5/04 ,  F21V5/045 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L2933/0091

Abstract: A light-emitting diode and a light module are disclosed. In an embodiment the light-emitting diode includes at least one light-emitting diode chip and a first optical element, which is reflective for light generated by the at least one light-emitting diode chip during operation, wherein the first optical element completely covers at least one of the at least one light-emitting diode chip in a plan view