公开(公告)号：US20210098433A1

公开(公告)日：2021-04-01

申请号：US17050114

申请日：2019-04-26

Applicant: OSRAM GmbH

Inventor： Alberto Alfier ,  Xiaolong LI

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/62

Abstract: A multi-COB-LED lighting module includes a submount; and a plurality of clusters of LED-chips that emit light radiation in respective emission bands, wherein each LED-chip cluster includes a plurality of LED-chips arranged on the submount by chip on board technology and emit light radiation in a respective emission band, and at least two LED-chips of at least a first LED-chip cluster each borders with a plurality of LED-chips belonging to one or more clusters of LED-chips different from the first LED-chip cluster and connect one to the other by at least a wire bond that extends above one or more of the adjoining LED-chips.