公开(公告)号：US20210242367A1

公开(公告)日：2021-08-05

申请号：US17053800

申请日：2019-05-08

Applicant: Osram OLED GmbH

Inventor： Michael VÖLKL ,  Siegfried HERRMANN

IPC: H01L33/14 ,  H01L25/16 ,  H01L33/60 ,  H01L33/50

Abstract: An optoelectronic semiconductor device may include a first semiconductor layer, a second semiconductor layer, first and second current spreading structures, and an insulating intermediate layer. The second semiconductor layer may be arranged over a substrate. The first semiconductor layer may be arranged between the second semiconductor layer and the substrate. The first current spreading structure may be electrically connected to the first semiconductor layer, and the second current spreading structure electrically may be connected to the second semiconductor layer. The insulating intermediate layer may include a dielectric mirror and may be arranged between the second current spreading structure and the second semiconductor layer. The current spreading structures may overlap one another in a plane perpendicular to a main surface of the substrate. The first current spreading structure may be arranged at a larger distance from the first semiconductor layer than the second current spreading structure.

公开(公告)号：US20210091263A1

公开(公告)日：2021-03-25

申请号：US16768594

申请日：2018-12-13

Applicant: OSRAM OLED GMBH

Inventor： Siegfried HERRMANN ,  Michael VÖLKL

IPC: H01L33/20 ,  F21K9/90 ,  H01L25/075 ,  H05K3/00 ,  H01L33/52 ,  H05K3/28 ,  H01L33/64 ,  H05K1/05

Abstract: The invention relates to a method for producing a semiconductor component comprising a radiation-emitting optical semiconductor chip or a plurality of radiation-emitting optical semiconductor chips, said method comprising: applying the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips to a deformable flat support deforming the support; and permanently fixing the deformation.