公开(公告)号：US08743166B2

公开(公告)日：2014-06-03

申请号：US13748675

申请日：2013-01-24

Applicant: Oki Data Corporation

Inventor： Eisuke Kuroki ,  Takahito Suzuki ,  Kenichi Tanigawa

IPC: B41J2/45 ,  H01L29/18 ,  H01L33/00

CPC classification number: H01L33/54 ,  G03G15/04 ,  G03G15/04054 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting device includes a substrate; a light-emitting element formed on the substrate; a seal member sealing the light-emitting element, the seal member formed of a transparent dry film resist laminated on the substrate with the light-emitting element interposed therebetween.

Abstract translation: 发光装置包括：基板; 形成在所述基板上的发光元件; 密封构件，其密封发光元件，所述密封构件由层叠在所述基板上的透明干膜抗蚀剂形成，所述透明干膜抗蚀剂之间插入有发光元件。

公开(公告)号：US09776427B2

公开(公告)日：2017-10-03

申请号：US15160354

申请日：2016-05-20

Applicant: Oki Data Corporation

Inventor： Akihiro Yamamura ,  Eisuke Kuroki

IPC: B41J2/45 ,  G03G15/04

CPC classification number: B41J2/45 ,  G03G15/04054 ,  G03G15/0409

Abstract: An exposure device includes an optical system member that forms an image of light from a light emitting element array having multiple light emitting elements arranged, an optical system support part that supports the optical system member, and a restraining member that restrains the optical system member to the optical system support part. The optical system support part has sliding parts, which are able to slide relative to the restraining member, formed on a light emitting element side face and an image forming side face in positions opposing the both end parts or the vicinity of both end parts in a longitudinal direction of the optical system support part, and in the both end parts or in the vicinity of the both end parts in the longitudinal direction, the restraining member is formed between the sliding parts and the optical system member, fixed to the optical system member, and slidable in the longitudinal direction relative to the optical system support part.

公开(公告)号：US09338890B2

公开(公告)日：2016-05-10

申请号：US14724286

申请日：2015-05-28

Applicant: Oki Data Corporation

Inventor： Takahito Suzuki ,  Eisuke Kuroki

IPC: H05K1/18

CPC classification number: H05K1/181 ,  B41J2/447 ,  H05K2201/09827 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A semiconductor device includes: a printed wiring board; plural semiconductor array elements mounted on the printed wiring board in a row with an adhesive, each of the semiconductor array elements including plural semiconductor elements arranged in a row, the semiconductor array elements including a first semiconductor array element and a second semiconductor array element adjacent to the first semiconductor array element, the first semiconductor array element having a first facing surface, the second semiconductor array element having a second facing surface facing the first facing surface; a first contact prevention member that is made of organic material and disposed to project from the first facing surface; and a second contact prevention member that is made of organic material and disposed to project from the second facing surface. The first and second contact prevention members are disposed to abut each other or face each other with a gap therebetween.

Abstract translation: 半导体器件包括：印刷线路板; 多个半导体阵列元件，其安装在具有粘合剂的一排的印刷线路板上，每个半导体阵列元件包括排列成一行的多个半导体元件，所述半导体阵列元件包括与第一半导体阵列元件相邻的第一半导体阵列元件和第二半导体阵列元件 所述第一半导体阵列元件，所述第一半导体阵列元件具有第一面对表面，所述第二半导体阵列元件具有面对所述第一相对表面的第二面对表面; 第一接触防止构件，其由有机材料制成并且设置成从所述第一面向表面突出; 以及第二防止接触部件，其由有机材料制成并且设置成从所述第二相对表面突出。 第一和第二接触防止构件被设置成彼此邻接或彼此面对地间隔开。