Resampling with TDI Sensors
    1.
    发明公开

    公开(公告)号:US20230408579A1

    公开(公告)日:2023-12-21

    申请号:US18035148

    申请日:2021-08-08

    Applicant: Orbotech Ltd.

    CPC classification number: G01R31/308 H04N25/768 H04N25/48

    Abstract: Apparatus for inspecting electrical circuits including a scanner including at least one multiline Time Delay Integration (TDI) sensor having multiple parallel lines of sensor pixels, the multiple lines being separated from each other by a separation distance along a scanning axis, each of the sensor pixels having a sensor pixel dimension along the scanning axis, a linear displacer providing mutual displacement of the TDI sensor and an electrical circuit to be inspected along the scanning axis and scanning optics directing light reflected from the electrical circuit to the sensor pixels, the scanning optics defining a projection of each sensor pixel onto the electrical circuit, which projection defines the area on the electrical circuit from which light reaches each sensor pixel, each projection having a sensor pixel projection dimension along the scanning axis and an image generator constructing an image from composite output pixels of the TDI sensor.

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