Improving Processing of a Flexible Circuit Board (CB) Using a Vacuum Plate Adapted to the CB Design

    公开(公告)号:US20240292587A1

    公开(公告)日:2024-08-29

    申请号:US18573214

    申请日:2022-10-12

    Applicant: Orbotech Ltd.

    CPC classification number: H05K13/0069 B25B11/005

    Abstract: A system includes a plate and a vacuum source. The plate has a first surface and a second surface opposite the first surface, the plate is configured to receive on the first surface a flexible substrate including a first section having a first flexibility and a second section having a second flexibility different from the first flexibility, the plate has through-holes (TH), between the first and second surfaces, with a variable density that varies from a first pattern arranged in a first density opposite the first section to a second pattern arranged in a second density, different from the first density, opposite the second section. The vacuum source is configured to draw a vacuum in the TH between the first and second surfaces for fixing the first section to the first pattern and the second section to the second pattern.

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