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    METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC DEVICE
    1.
    发明申请
    METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC DEVICE 审中-公开
    制造多层陶瓷电子器件的方法

    公开(公告)号：US20100038013A1

    公开(公告)日：2010-02-18

    申请号：US12606332

    申请日：2009-10-27

    Applicant: Osamu CHIKAGAWA ,  Tetsuya IKEDA

    Inventor： Osamu CHIKAGAWA ,  Tetsuya IKEDA

    IPC: C03B29/14

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H05K1/0306 ,  H05K3/4614 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2203/308

    Abstract: In a method for manufacturing a multilayer ceramic substrate in which, after firing is performed while restriction layers which are not sintered in the firing are disposed on primary surfaces of an unsintered ceramic laminate, the restriction layers are removed, when a bonding force generated by each restriction layer is increased, the restriction layers cannot be easily removed, and when the restriction layers are designed to be easily removed, the bonding force decreases. In an unsintered ceramic laminate, conductive patterns containing Ag as a primary component are formed, and in addition, at least one first base layer and at least one second base layer are also laminated to each other. The second base layer is disposed along at least one primary surface of the unsintered ceramic laminate, and restriction layers are disposed so as to be in contact with the second base layers. The second base layer is formed to have a composition so that Ag is likely to diffuse during firing as compared to that of the first base layer, and as a result, the glass softening point decreases; hence, a restriction force is improved without using means for decreasing the particle diameter of a sintering resistant ceramic powder contained in the restriction layers.

    Abstract translation: 在制造多层陶瓷基板的方法中，在烧结之后，在烧结中未烧结的限制层设置在未烧结的陶瓷层叠体的主表面上的情况下，限制层被除去时， 限制层增加，限制层不能容易地去除，并且当限制层被设计为容易地去除时，结合力降低。 在未烧结的陶瓷层叠体中，形成含有Ag作为主要成分的导电图案，此外，至少一个第一基底层和至少一个第二基底层也层叠。 第二基层沿着未烧结陶瓷层叠体的至少一个主表面设置，限制层设置成与第二基层接触。 第二基底层形成为具有如下组成：Ag在烧结过程中与第一基底层相比可能扩散，结果玻璃软化点降低; 因此，在不使用减少限制层中所含的耐烧结陶瓷粉末的粒径的方法的情况下，改善了限制力。

    CERAMIC SUBSTRATE PRODUCTION PROCESS AND CERAMIC SUBSTRATE PRODUCED USING THE PROCESS
    2.
    发明申请
    CERAMIC SUBSTRATE PRODUCTION PROCESS AND CERAMIC SUBSTRATE PRODUCED USING THE PROCESS 有权
    陶瓷基板生产工艺和使用该工艺生产的陶瓷基板

    公开(公告)号：US20080308976A1

    公开(公告)日：2008-12-18

    申请号：US11862722

    申请日：2007-09-27

    Applicant: Yuki ITO ,  Osamu CHIKAGAWA ,  Tetsuya IKEDA

    Inventor： Yuki ITO ,  Osamu CHIKAGAWA ,  Tetsuya IKEDA

    IPC: C04B33/32

    CPC classification number: B32B18/00 ,  C04B35/63 ,  C04B35/6342 ,  C04B35/63424 ,  C04B2235/656 ,  C04B2237/32 ,  C04B2237/343 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/64 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/86 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/0014 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2203/0108 ,  H05K2203/0113 ,  Y10T156/10

    Abstract: A process for producing a multilayered ceramic substrate having a step portion of a desired shape does not require complicated process steps and equipment. An auxiliary-layer-lined unfired ceramic body, which has a step portion in a principal surface thereof, has an unfired ceramic body and an auxiliary layer which is adhered to one principal surface of the unfired ceramic body and which is made of a material that is substantially unsinterable at a temperature at which the unfired ceramic body is fired. The auxiliary-layer-lined unfired ceramic body is fired at a temperature at which the unfired ceramic body is sinterable but the auxiliary layer is substantially unsinterable, while the auxiliary layer remains adhered to the unfired ceramic body. A pressing operation is performed by using a die having a projection placed on the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer, so that the step portion, having a shape corresponding to the outer shape of the die projection, is formed in the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer.

    Abstract translation: 制备具有所需形状的台阶部分的多层陶瓷基板的方法不需要复杂的工艺步骤和设备。 在其主表面具有台阶部分的辅助层衬里的未烧结陶瓷体具有未烧结的陶瓷体和辅助层，该辅助层粘附在未烧结陶瓷体的一个主表面上，该辅助层由以下材料制成： 在未焙烧的陶瓷体被烧制的温度下基本上不能令人反应。 辅助层衬里的未焙烧陶瓷体在未焙烧的陶瓷体可烧结的温度下烧制，但辅助层基本上是不可相位的，而辅助层保持粘附到未焙烧的陶瓷体上。 通过使用具有放置在保持辅助层的辅助衬里未烧结陶瓷体侧的突起的模具进行按压操作，使得具有与模具突起的外形相对应的形状的台阶部分， 形成在保持辅助层的辅助层衬里的未烧结陶瓷体的侧面。

    MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 有权
    多层陶瓷基板及其制造方法

    公开(公告)号：US20100112284A1

    公开(公告)日：2010-05-06

    申请号：US12691782

    申请日：2010-01-22

    Applicant: Yuichi IIDA ,  Osamu CHIKAGAWA

    Inventor： Yuichi IIDA ,  Osamu CHIKAGAWA

    IPC: B32B3/10 ,  B32B3/00 ,  B29C65/02 ,  B29C65/56

    CPC classification number: H05K1/186 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/091 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T156/1002 ,  Y10T428/24322 ,  Y10T428/24612 ,  Y10T428/24926 ,  Y10T428/24942

    Abstract: A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer includes a second powder including a second ceramic material that will not be sintered at a temperature for melting the glass material, and is in such a state that the second powder adheres together by diffusion or flow of a portion of the first powder including the glass material included in the base material layer at the time of baking. The incorporated element is in such a state that an entire periphery thereof is covered with the interlayer constraining layer.

    Abstract translation: 层压体包括基材层和设置在其间的层间约束层。 所述基材层由包含玻璃材料和第一陶瓷材料的第一粉末的烧结体形成，所述中间层约束层包括第二粉末，所述第二粉末包括在用于熔化所述玻璃的温度下不被烧结的第二陶瓷材料 并且处于这样的状态，即第二粉末通过在烘烤时包含在基材层中的包含玻璃材料的第一粉末的一部分的扩散或流动而粘附在一起。 所引入的元件处于其整个外围被层间限制层覆盖的状态。

    METHOD FOR PRODUCING CERAMIC BODY
    7.
    发明申请
    METHOD FOR PRODUCING CERAMIC BODY 有权
    生产陶瓷体的方法

    公开(公告)号：US20110088831A1

    公开(公告)日：2011-04-21

    申请号：US12961530

    申请日：2010-12-07

    Applicant: Osamu CHIKAGAWA

    Inventor： Osamu CHIKAGAWA

    IPC: B32B37/02 ,  B32B37/06 ,  B32B37/14 ,  B32B38/10

    CPC classification number: H05K3/4611 ,  B32B18/00 ,  C04B35/645 ,  C04B2235/365 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/56 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2203/025 ,  H05K2203/0746 ,  H05K2203/308

    Abstract: A laminated body includes, in sequence, a base layer mainly composed of a ceramic material and a glass material, a first constraining layer that is primarily made of a ceramic material that is not sintered at a temperature at which the base layer is sintered, a second constraining layer primarily made of a ceramic material and a glass material that are sintered at the temperature at which the base layer is sintered, and a third constraining layer primarily made of a ceramic material that is not sintered at the temperature at which the base layer is sintered. The laminated body is subsequently fired at the temperature at which the base layer is sintered. The first, second, and third constraining layers are removed from the fired laminated body to provide a ceramic body that is a sinter of the base layer. After the firing, adhesion between the base layer and the first constraining layer and adhesion between the second constraining layer and the first constraining layer are different from each other.

    Abstract translation: 层叠体依次包括主要由陶瓷材料和玻璃材料构成的基层，主要由在烧结基底层的温度下不烧结的陶瓷材料制成的第一约束层， 主要由陶瓷材料制成的第二约束层和在烧结基底层的温度下烧结的玻璃材料，以及主要由陶瓷材料制成的第三约束层，该陶瓷材料在基底层 被烧结。 随后在基层烧结的温度下烧结层压体。 将第一，第二和第三约束层从烧制的层压体上移除，以提供作为基层的烧结体的陶瓷体。 在点火之后，基层与第一约束层之间的粘合以及第二约束层与第一约束层之间的粘附性彼此不同。

    LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    层压陶瓷电子元件及其制造方法

    公开(公告)号：US20110036622A1

    公开(公告)日：2011-02-17

    申请号：US12850707

    申请日：2010-08-05

    Applicant: Osamu CHIKAGAWA ,  Tetsuya IKEDA

    Inventor： Osamu CHIKAGAWA ,  Tetsuya IKEDA

    IPC: H05K1/09 ,  B29C65/02

    CPC classification number: B32B18/00 ,  C04B2237/343 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/19105 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2203/308

    Abstract: In a method for manufacturing a laminated ceramic electronic component, in order to form a green ceramic laminate to be fired, first ceramic green layers which include first conductor patterns including Ag as a main component and which include a first ceramic material including a first glass component are disposed in surface layer portions. Second ceramic green layers which include second conductor patterns including Ag as a main component, which include a second ceramic material containing a second glass component, and which include a composition in which Ag diffuses than more easily in the first ceramic green layer during firing are disposed in inner layer portions. The green ceramic laminate is fired to produce a multilayer ceramic substrate.

    Abstract translation: 在层叠陶瓷电子部件的制造方法中，为了形成烧成的生坯陶瓷层叠体，具有包含Ag作为主要成分的第一导体图案的第一陶瓷生坯层，其包含第一陶瓷材料，所述第一陶瓷材料包括第一玻璃成分 设置在表层部。 布置第二陶瓷绿色层，其包括包括Ag作为主要成分的第二导体图案，其包括含有第二玻璃组分的第二陶瓷材料，并且其包括其中Ag在焙烧期间在第一陶瓷生坯层中更容易扩散的组合物 在内层部分。 将生坯陶瓷层压体烧制以制备多层陶瓷基板。

    CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING THE SAME
    10.
    发明申请
    CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING THE SAME 有权
    陶瓷多层基板及其制造方法

    公开(公告)号：US20100155118A1

    公开(公告)日：2010-06-24

    申请号：US12720745

    申请日：2010-03-10

    Applicant: Yoshiko OKADA ,  Osamu CHIKAGAWA ,  Hidekiyo TAKAOKA ,  Shodo TAKEI

    Inventor： Yoshiko OKADA ,  Osamu CHIKAGAWA ,  Hidekiyo TAKAOKA ,  Shodo TAKEI

    IPC: H05K1/09 ,  H05K1/03 ,  H05K3/10

    CPC classification number: H05K3/4629 ,  H01G2/02 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/186 ,  H05K3/4611 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49155

    Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

    Abstract translation: 另外，在芯片型陶瓷部件的陶瓷多层基板中，即使在陶瓷多层基板的表面上安装有芯片型陶瓷部件，也可以将芯片型陶瓷部件与内部导体或表面 陶瓷多层基板的电极大大改善和增加。 陶瓷多层基板包括层叠有多个陶瓷层的陶瓷层叠体，设置在陶瓷层叠体中的内部导体，设置在陶瓷层叠体的上表面的表面电极以及与该陶瓷层叠体接合的芯片型陶瓷构件 内部导体或表面电极通过外部电极。 内部导体或表面电极通过连接电极接合到外部电极，连接电极与内部导体，表面电极和外部电极中的任一个形成固溶体。

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