SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING
    2.
    发明申请
    SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING 有权
    电子设备冷却系统,结构和材料

    公开(公告)号:US20140043754A1

    公开(公告)日:2014-02-13

    申请号:US14055616

    申请日:2013-10-16

    Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

    Abstract translation: 具有在运行中产生热量的一个或多个部件的电子设备包括用于温度管理和散热的结构。 用于温度管理和散热的结构包括具有与周围环境热连通的表面的传热基板和与电子设备的一个或多个部件的至少一部分物理接触的温度管理材料, 至少一部分传热基板。 温度管理材料包括具有至少5焦耳/克的潜热和0℃至100℃之间的转变温度和导热填料的聚合物相变材料。

    Systems, structures and materials for electronic device cooling
    5.
    发明授权
    Systems, structures and materials for electronic device cooling 有权
    用于电子设备冷却的系统,结构和材料

    公开(公告)号:US09392730B2

    公开(公告)日:2016-07-12

    申请号:US14055616

    申请日:2013-10-16

    Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

    Abstract translation: 具有在运行中产生热量的一个或多个部件的电子设备包括用于温度管理和散热的结构。 用于温度管理和散热的结构包括具有与周围环境热连通的表面的传热基板和与电子设备的一个或多个部件的至少一部分物理接触的温度管理材料, 至少一部分传热基板。 温度管理材料包括具有至少5焦耳/克的潜热和0℃至100℃之间的转变温度和导热填料的聚合物相变材料。

    Polymeric composites having enhanced reversible thermal properties and methods of forming thereof
    6.
    发明申请
    Polymeric composites having enhanced reversible thermal properties and methods of forming thereof 审中-公开
    具有增强的可逆热性质的聚合物复合材料及其形成方法

    公开(公告)号:US20150018480A1

    公开(公告)日:2015-01-15

    申请号:US14492691

    申请日:2014-09-22

    Inventor: Mark Hartmann

    Abstract: Polymeric composites and methods of manufacturing polymeric composites are described. In one embodiment, a set of microcapsules containing a phase change material are mixed with a dispersing polymeric material to form a first blend. The dispersing polymeric material has a latent heat of at least 40 J/g and a transition temperature in the range of 0° C. to 50° C. The first blend is processed to form a polymeric composite. The polymeric composite can be formed in a variety of shapes, such as pellets, fibers, flakes, sheets, films, rods, and so forth. The polymeric composite can be used as is or incorporated in various articles where a thermal regulating property is desired.

    Abstract translation: 描述聚合物复合材料和制备聚合物复合材料的方法。 在一个实施方案中,将含有相变材料的一组微胶囊与分散聚合物材料混合以形成第一共混物。 分散聚合物材料具有至少40J / g的潜热和0℃至50℃范围内的转变温度。将第一共混物加工形成聚合复合材料。 聚合物复合材料可以形成为各种形状,例如颗粒,纤维,薄片,薄片,薄膜,棒等。 聚合物复合材料可以原样使用或并入其中需要热调节性能的各种制品中。

    SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTROCHEMICAL DEVICE THERMAL MANAGEMENT
    10.
    发明申请
    SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTROCHEMICAL DEVICE THERMAL MANAGEMENT 有权
    电化学设备热管理的系统,结构和材料

    公开(公告)号:US20160226042A1

    公开(公告)日:2016-08-04

    申请号:US14614223

    申请日:2015-02-04

    Abstract: This disclosure provides a casing for the thermal management and protection of an electrochemical cell. The casing may comprise an inner surface configured to be in physical contact with at least a portion of an outer surface of an electrochemical cell. The inner surface may be substantially solid at room temperature. The casing may also comprise a polymer matrix which itself comprises two or more temperature management materials. At least one of the two or more temperature management materials may comprise a microencapsulated phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and at least one other of the two or more temperature management materials may comprise an elastomeric material. The polymer matrix may be substantially homogeneous.

    Abstract translation: 本公开提供了一种用于电化学电池的热管理和保护的外壳。 壳体可以包括构造成与电化学电池的外表面的至少一部分物理接触的内表面。 内表面可以在室温下基本上是固体的。 套管还可以包括本身包含两个或多个温度管理材料的聚合物基质。 两种或更多种温度管理材料中的至少一种可以包括具有至少5焦耳/克的潜热和0℃至100℃之间的转变温度的微囊化相变材料,以及至少一个 两种或多种温度管理材料可以包括弹性体材料。 聚合物基质可以是基本均匀的。

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