公开(公告)号：US20150075852A1

公开(公告)日：2015-03-19

申请号：US14389525

申请日：2014-03-11

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino ,  Takashi Hoshi

IPC: C09D163/04 ,  H05K1/02 ,  H05K1/05 ,  C09D163/00 ,  H05K1/03

CPC classification number: C09D163/04 ,  C08J5/24 ,  C08J2333/06 ,  C09D163/00 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249921 ,  Y10T442/20

Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

Abstract translation: 根据本发明的预浸料由树脂组合物和浸渍有树脂组合物的织物基材形成。 树脂组合物含有：（A）热固性树脂组合物; （B）Tg不高于100℃的树脂; 和（C）无机填料。 Tg不大于100℃的树脂（B）具有：羰基或硅氧烷基; 和环氧基或酚羟基。 无机填料（C）用由通式YSiX 3表示的硅烷偶联剂进行表面处理，其中X表示甲氧基或乙氧基，Y表示碳原子数为6〜18的脂肪族烷基。

公开(公告)号：US09102850B2

公开(公告)日：2015-08-11

申请号：US14389525

申请日：2014-03-11

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino ,  Takashi Hoshi

IPC: C09D163/04 ,  H05K1/02 ,  H05K1/05 ,  C08J5/24 ,  H05K1/03 ,  C09D163/00

CPC classification number: C09D163/04 ,  C08J5/24 ,  C08J2333/06 ,  C09D163/00 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249921 ,  Y10T442/20

Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

Abstract translation: 根据本发明的预浸料由树脂组合物和浸渍有树脂组合物的织物基材形成。 树脂组合物含有：（A）热固性树脂组合物; （B）Tg不高于100℃的树脂; 和（C）无机填料。 Tg不大于100℃的树脂（B）具有：羰基或硅氧烷基; 和环氧基或酚羟基。 无机填料（C）用由通式YSiX 3表示的硅烷偶联剂进行表面处理，其中X表示甲氧基或乙氧基，Y表示碳原子数为6〜18的脂肪族烷基。