Abstract:
The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate (alpha), as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
Abstract:
The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate a, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
Abstract:
The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (α), as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.
Abstract:
The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
Abstract:
A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
Abstract:
Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).
Abstract:
The present invention relates to a dry film for optical waveguides, obtained through sequential stacking of a carrier film, a plating adhesion layer, an uncured cladding layer and a cover film. Solid microparticles are dispersed in a resin composition that constitutes the plating adhesion layer.