公开(公告)号：US09839155B2

公开(公告)日：2017-12-05

申请号：US13891351

申请日：2013-05-10

Applicant: Panduit Corp.

Inventor： James N. Fleming ,  Timothy Goldsberry ,  Mark Shurhay ,  Max W. Hibner

IPC: H05K7/20 ,  B23P19/00

CPC classification number: H05K7/20145 ,  B23P19/00 ,  H05K7/20736 ,  Y10T29/49826

Abstract: A thermal ducting system for electronic equipment in an electronic equipment enclosure is provided. The thermal ducting system includes a top duct, a bottom duct spaced apart from the top duct, a side duct extending from the top duct to the bottom duct and along an intake side of the electronic equipment, and at least one baffle positioned in the side duct.

公开(公告)号：US20130309957A1

公开(公告)日：2013-11-21

申请号：US13891351

申请日：2013-05-10

Applicant: PANDUIT CORP.

Inventor： James N. Fleming ,  Timothy Goldsberry ,  Mark Shurhay ,  Max W. Hibner

IPC: H05K7/20 ,  B23P19/00

CPC classification number: H05K7/20145 ,  B23P19/00 ,  H05K7/20736 ,  Y10T29/49826

Abstract: A thermal ducting system for electronic equipment in an electronic equipment enclosure is provided. The thermal ducting system includes a top duct, a bottom duct spaced apart from the top duct, a side duct extending from the top duct to the bottom duct and along an intake side of the electronic equipment, and at least one baffle positioned in the side duct.

Abstract translation: 提供了一种用于电子设备外壳中的电子设备的导热管道系统。 热管道系统包括顶部管道，与顶部管道间隔开的底部管道，从顶部管道延伸到底部管道并且沿着电子设备的进气侧延伸的侧管道，以及位于侧面的至少一个挡板 管。