公开(公告)号：US10191080B2

公开(公告)日：2019-01-29

申请号：US15176094

申请日：2016-06-07

Applicant: PARROT DRONES

Inventor： Quentin Quadrat ,  Cedric Chaperon ,  Henri Seydoux

IPC: G01P21/00 ,  G01C19/00 ,  G05D23/19 ,  B64C39/02 ,  G01C21/16

Abstract: The inertial unit, IMU, of the drone is mounted on a main circuit board. The IMU (26) includes an internal temperature sensor delivering a chip temperature signal (θ°chip). A heating component (36) is mounted on the circuit board near the IMU, and it is provided a thermal guide, incorporated to the circuit board, extending between the heating component and the IMU so as to allow a transfer to the IMU of the heat produced by the heating component. This thermal guide may in particular be a metal planar layer incorporated to the board, in particular a ground plane. A thermal regulation circuit (44-62) receives as an input the chip temperature signal (θchip) and a set-point temperature signal (θ°ref), and delivers a piloting signal (TH_PWM) of the heating component, so as to control the heat supply to the IMU. It is in particular possible to use this fast increase in temperature to perform a complete calibration of the IMU in a few minutes.

公开(公告)号：US20160370404A1

公开(公告)日：2016-12-22

申请号：US15176094

申请日：2016-06-07

Applicant: PARROT DRONES

Inventor： Quentin Quadrat ,  Cedric Chaperon ,  Henri Seydoux

IPC: G01P21/00 ,  B64C39/02

CPC classification number: G01P21/00 ,  B64C39/024 ,  G01C19/00 ,  G01C21/16 ,  G05D23/1919

Abstract: The inertial unit, IMU, of the drone is mounted on a main circuit board. The IMU (26) includes an internal temperature sensor delivering a chip temperature signal (θ°chip). A heating component (36) is mounted on the circuit board near the IMU, and it is provided a thermal guide, incorporated to the circuit board, extending between the heating component and the IMU so as to allow a transfer to the IMU of the heat produced by the heating component. This thermal guide may in particular be a metal planar layer incorporated to the board, in particular a ground plane. A thermal regulation circuit (44-62) receives as an input the chip temperature signal (θchip) and a set-point temperature signal (θ°ref), and delivers a piloting signal (TH_PWM) of the heating component, so as to control the heat supply to the IMU. It is in particular possible to use this fast increase in temperature to perform a complete calibration of the IMU in a few minutes.

Abstract translation: 无人机的惯性单元IMU安装在主电路板上。 IMU（26）包括提供芯片温度信号（θ°芯片）的内部温度传感器。 加热部件（36）安装在靠近IMU的电路板上，并且设置有一个热引导件，该引导件结合到电路板上，在加热部件和IMU之间延伸，以便允许传送到IMU的热量 由加热部件产生。 该导热器可以特别地是与基板结合的金属平面层，特别是接地平面。 热调节电路（44-62）接收芯片温度信号（θchip）和设定点温度信号（θ°ref）作为输入，并传送加热部件的导频信号（TH_PWM），以便控制 向IMU供热。 特别是可以在几分钟内使用这种快速增加的温度来完成IMU的完整校准。