Wire scribed circuit boards and method of manufacture
    1.
    发明授权
    Wire scribed circuit boards and method of manufacture 失效
    电线电路板及其制造方法

    公开(公告)号:US3674914A

    公开(公告)日:1972-07-04

    申请号:US3674914D

    申请日:1970-03-05

    Inventor: BURR ROBERT PAGE

    Abstract: The present invention represents a new approach to solving modern electronic packaging problems which combines in one system the best features of discrete wiring techniques and printed circuits. According to this invention, there are provided new and useful procedures whereby a prefabricated organized wire interconnecting device, hereinafter referred to as a wire scribed circuit board, is produced by writing or plotting a predetermined circuit interconnection onto the surface of an insulating base using as the writing medium or ''''ink'''' a continuous wire filament. The wire is fed onto the surface of the base continuously from one side thereof, simultaneously affixed to the base to form the interconnecting pattern, and cut at the finish of each line, to thereby form a written wire image of a predetermined interconnecting pattern on the base. Preferred embodiments of the wire scribed boards include a wire image of a predetermined interconnecting pattern in which wire conductors exhibit inflection points produced solely as a result of the writing technique and/or crossovers in essentially the same plane as the wire, as well as connection terminals to which the written wire lines and/or electrical components may be attached. The boards resemble a printed circuit board in appearance and cubic packing potential, although no art work or graphic processes of any kind are employed in their production. Unlike printed circuit boards, repairs as by conductor additions or deletions or modifications may be readily made.

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