公开(公告)号：US3399268A

公开(公告)日：1968-08-27

申请号：US55591866

申请日：1966-06-07

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE JR FREDERICK W ,  MCCORMACK JOHN F ,  ZEBLISKY RUDOLPH J ,  WILLIAMSON JOHN D ,  JOSEPH POLICHETTE

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  H01B1/00 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K3/422 ,  C23C18/1608 ,  C23C18/2086 ,  C23C18/405 ,  H01B1/00 ,  H05K1/0373 ,  H05K2201/0236

公开(公告)号：US3615737A

公开(公告)日：1971-10-26

申请号：US3615737D

申请日：1969-08-04

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK W JR ,  MCCORMACK JOHN F ,  ZEBLISKY RUDOLPH J ,  WILLIAMSON JOHN D

IPC: C23C18/40 ,  C23C3/02

CPC classification number: C23C18/40

Abstract: An improved electroless metal deposition solution is provided which comprises, in combination: an ion of a metal whose electroless metal deposition is desired; a complexing agent for said ion; a reducing agent for said ion; a pH regulator; and a small effective amount of an extraneous ion which has a potential dependent capacity for inner double layer absorption at a surface in contact with the solution on which said metal is electrolessly depositing. In addition, improved methods for electrolessly depositing metal, as well as enhancing the ductility of electroless metal deposits are provided.